Manufacturer Part #
IAA Series 350 V 0.1 A SMT Multifunction Telecom Switch - SOIC-16
SOIC-16 Solder Reflow Data Sheet Changes Detailed Description of Change IXYS Integrated Circuits Division (ICD), now part of Littelfuse, has made specification changes to the Moisture Sensitivity and Soldering Profile segments contained within the Manufacturing Information section presented in the data sheets of the following devices: (see attached)The Moisture Sensitivity Level (MSL) classification of the 16-pin SOIC (SOIC-16) package has been changed from MSL 1 to MSL 3. In addition to the MSL classification change, the Classification Temperature (maximum body temperature) of this package has been reduced from 260�C to 240�C. These changes are effective immediately and are documented in the recent revision of the product's data sheets which are available online at www.ixysic.com. Anticipated Impact on Quality and Reliability This change will improve the quality and reliability of the product received by the customer and throughout their PCB assembly manufacturing process.