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Product Specification Section
Pricing Section

Stock: 4,500

On Order: 0
Factory Stock:Factory Stock: 19,500
Factory Lead Time: 5-10 Days
Minimum Order: 1,500
Multiple Of: 1,500
Quantity Web Price
1,500+ $0.40


Attributes Table
No of Positions 4
Pitch 1 mm
Style/Orientation Receptacle
Termination Solder
Operating Temp Range -40°C to +85°C
Voltage Rating 200V
Current Rating 1A
Contact Material Phosphor Bronze
Contact Plating Tin
Material LCP
No of Rows 1
Gender Female
Type Wire to Board
Color Natural
Features and Applications

The 84952-4 is a part of Wire to Board connectors with low profile and light-weight features having reduced size, weight and assembly cost.

This is widely used in computer industry, particularly in such applications as Lap Top, Notebook, Palm Top and Note Pad Computers. Other markets include: Disk Drives, Printers, Plotters, Copiers, Cellular Phones, and Medical Equipment. Operating temprature ranges from -40°C – +85°C

Product Features:

  • 4 Positions
  • Matte Tin Contact Plating, Mating Area, Material
  • Contact Plating, Mating Area, Thickness = 2 µm
  • Liquid Crystal Polymer (LCP) Housing Material
  • Contact Current Rating, Max (A) = 1
  • Operating Voltage (VAC) = 200
  • Selectively Loaded = No
  • PCB Mount Retention Type = Solder Pads
  • Profile Height (Y-Axis) = 2.56 mm
  • Contact Plating, Mating Area, Material = Matte Tin
  • Housing Material = Liquid Crystal Polymer (LCP)
  • Contact Mating Location = Bottom
  • Lead Free Solder Processes = Reflow solder capable to 245°C, Reflow solder capable to 260°C
  • Contact Design = Single Beam