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Manufacturer Part #
24LC515-I/SM
Download the CAD models for this product. Learn more about SnapMagic.
90 per Tube
SOIJ-8
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
Product Category: MemoryDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 24AA1025, 24AA1026, 24AA128, 24AA256, 24AA32A, 24AA512, 24AA515, 24AA64, 24CS128, 24CS256, 24CS32, 24CS512, 24CS64, 24CSM01, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC1025, 24FC1026, 24FC128, 24FC256, 24FC512, 24FC515, 24FC64, 24LC1025, 24LC1026, 24LC128, 24LC256, 24LC32A, 24LC512, 24LC515, 24LC64, 25AA1024, 25LC1024, AT24C512C, AT24CM01 and AT25M01 device families available in 8L SOIC (.150in) and 8L SOIJ (.208in) packages at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material at MTAI assembly site.Estimated First Ship Date: 15 April 2026 (date code: 2616)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
PCN Status:Final NotificationDescription of Change:Qualification of United Microelectronics Corporation - Fab 8D (U08D) as new fabrication site for selected 24LC515, 24AA515, and 24FC515 device families available in 8L SOIJ (.208in) and 8L PDIP (.300in) packages.Reason for Change:To improve manufacturability by qualifying United Microelectronics Corporation - Fab 8D (U08D) as a new wafer fabrication site.
Description of Change:Qualification of United Microelectronics Corporation - Fab 8D (U08D) as new fabrication site for selected 24LC515, 24AA515, and 24FC515 device families available in 8L SOIJ (.208in) and 8L PDIP (.300in) packages.Reason for Change:To improve manufacturability by qualifying United Microelectronics Corporation - Fab 8D (U08D) as a new wafer fabrication site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:February 2023
Part Status:
The 24LC515 (24XX515*) is a 64K x 8 (512K bit) Serial Electrically Erasable PROM, capable of operation across a broad voltage range (1.7V to 5.5V). It has been developed for advanced, low-power applications such as personal communications or data acquisition. This device has both byte write and page write capability of up to 64 bytes of data.
This device is capable of both random and sequential reads. Reads may be sequential within address boundaries 0000h to 7FFFh and 8000h to FFFFh. Functional address lines allow up to four devices on the same data bus. This allows for up to 2 Mbits total system EEPROM memory. This device is available in the standard 8-pin plastic DIP and SOIJ packages.
Features:
On Order
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.