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Manufacturer Part #
PIC16F15275-E/PT
Microchip PIC16F15275-E/PT - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:August 26, 2021: Issued initial notification.March 29, 2022: Issued final notification. Provided estimated first ship date to be on April 29, 2022.September 30, 2022: Re-issued final notification. Updated wire material for ASCL assembly site to add CuPdAu bond wire. Updated affected part list to remove catalog part numbers ATMEGA324PB-AN, ATMEGA324PB-ABT and add CPN PIC16F18075-I/P based on the updated scope. Updated subject notification, reason for change and qual title accordingly.October 28, 2022: Re-issued final notification with qual report. Updated Estimated Implementation and Estimated First Ship date to November 10, 2022.Description of Change:Qualification of MTAI as an additional assembly site for selected ATMEGA324PBxxx and PIC16F1xxx device families available in 44L TQFP (10x10x1mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional assembly site.
Revision History:August 26, 2021: Issued initial notification.March 29, 2022: Issued final notification. Provided estimated first ship date to be on April 29, 2022.September 30, 2022: Re-issued final notification. Updated wire material for ASCL assembly site to add CuPdAu bond wire. Updated affected part list to remove catalog part numbers ATMEGA324PB-AN, ATMEGA324PB-ABT and add CPN PIC16F18075-I/PT based on the updated scope. Updated subject notification, reason for change and qual title accordingly.Description of Change:Qualification of MTAI as an additional assembly site for selected ATMEGA324PBxxx and PIC16F1xxx device families available in 44L TQFP (10x10x1mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional assembly site.
Microchip has released a new Errata for the PIC16F15256/74/75/76 Silicon Errata and Datasheet Clarifications of devices. Description of Change: Added silicon errata item 1.6.1.Reason for Change: To Improve Productivity Date Document Changes Effective: 05 Sep 2022NOTE: Please be advised that this is a change to the document only the product has not been change
Microchip has released a new Product Documents for the PIC16F15256/74/75/76 Silicon Errata and Data Sheet Clarifications of devices.Notification Status: FinalDescription of Change:- Added silicon errata item 1.5.1.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteEstimated First Ship Date: 4 May 2022
Microchip has released a new Product Documents for the PIC16F15256/74/75/76 28/40-Pin Microcontrollers Data Sheet of devices. Notification Status: FinalDescription of Change: 1) Revised Figure 8-1 to remove OSCCAL. 2) Revise the packing legend.Impacts to Data Sheet: NoneReason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 4 May 2022
Revision History:August 26, 2021: Issued initial notification.March 29, 2022: Issued final notification. Provided estimated first ship date to be on April 29, 2022Description of Change:Qualification of MTAI as an additional assembly site for selected ATMEGA324PBxxx and PIC16F1527xxx device families available in 44L TQFP (10x10x1mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional assembly site.
Microchip has released a new Product Documents for the PIC16F15256/74/75/76 Silicon Errata and Data Sheet Clarifications of devicesNotification Status: FinalDescription of Change:1) Updated Table 2. Added silicon erratum 1.1.1, 1.2.1, 1.3.1, and 1.4.1. Added new silicon Rev A1.2) Minor correctionsImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteEstimated First Ship Date: 15 Mar 2022
Part Status:
Available Packaging
Package Qty:
160 per Std. Mfr. Pkg