Manufacturer Part #
MCP6241RT-E/OT
SINGLE 1.8V, 550 KHZ OP, E TEMP
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Reel Package Style:SOT-23-5 (SOT-25) Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2504 | ||||||||||
Microchip MCP6241RT-E/OT - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
*** Update for PCN 113195 ***Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected MCP111T, MCP60xx, MCP62xxx, MCP6401xx, MCP654xxx, MCP656xxx, MCP6G01xx, MCP6Lxxxx, TC1270ALxxx, TC1270AMxxx, TC1270ANxxx, TC1270ARxxx, TC1270ASxxx, TC1270ATxxx and TC1271Axxxx device families available in in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire as a new wire material.Estimated First Ship Date: 08 July 2025 (date code: 2528)Revision History: May 26, 2025: Issued final notification. June 3, 2025: Re-issued final notification to include Backside Coat material.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected MCP111T, MCP60xx, MCP62xxx, MCP6401xx, MCP654xxx, MCP656xxx, MCP6G01xx, MCP6Lxxxx, TC1270ALxxx, TC1270AMxxx, TC1270ANxxx, TC1270ARxxx, TC1270ASxxx, TC1270ATxxx and TC1271Axxxx device families available in in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire as a new wire material.Estimated First Ship Date: 08 July 2025 (date code: 2528)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP11xxx, MCP60xxx, MCP61xxx, MCP62xxx, MCP64xxx, MCP65xxx, MCP6Gxxx, MCP6Lxxx, and TC127xxx device families available in 6L and 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
PCN Status:Initial NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP11xxx, MCP60xxx, MCP61xxx, MCP62xxx, MCP64xxx, MCP65xxx, MCP6Gxxx, MCP6Lxxx, and TC127xxx device families available in 6L and 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Part Status:
Microchip MCP6241RT-E/OT - Technical Attributes
| Amplifier Type: | General Purpose |
| No of Channels: | 1 |
| Slew Rate-Nom: | 0.3V/µs |
| Input Offset Voltage-Max: | 7mV |
| Gain Bandwidth Product: | 550kHz |
| Average Bias Current-Max: | 1pA |
| Supply Voltage: | 1.8V to 5.5V |
| Common Mode Rejection Ratio: | 75dB |
| Supply Current: | 50µA |
| Output Type: | Rail to Rail |
| Power Supply Rejection Ratio: | 83dB |
| Operating Temp Range: | -40°C to +125°C |
| DC Voltage Gain: | 110dB |
| Phase Margin: | 68° |
| Low Noise: | 45nV/√Hz |
| Output Current: | 23mA |
| Package Style: | SOT-23-5 (SOT-25) |
| Mounting Method: | Surface Mount |
Features & Applications
The MCP6241 series of operational amplifier (Op Amp) provides wide bandwidth for the quiescent current. MCP6241 has a 550 kHz Gain Bandwidth Product (GBWP) and 68° (typ.) phase margin. This op amp operates from a single supply voltage as low as 1.8 V, while drawing 50 µA (typ.) quiescent current.
In addition, the MCP6241 supports rail-to-rail input and output swing, with a common mode input voltage range of VDD +300 mV to VSS -300 mV. This op amp is designed in one of Microchip's advanced CMOS processes. The MCP6241 operates in the Extended Temperature range of -40°C to +125°C. It has a power supply range of 1.8 V to 5.5 V.
Features:
- Gain Bandwidth Product: 550 kHz (typical)
- Supply Current: IQ = 50 µA (typical)
- Supply Voltage: 1.8 V to 5.5 V
- Rail-to-Rail Input/Output
- Extended Temperature Range: -40°C to +125°C
- Available in 5-pin SC-70 and SOT-23 packages
Applications:
- Automotive
- Portable Equipment
- Photodiode (Transimpedance) Amplifier
- Analog Filters
- Notebooks and PDAs
- Battery-Powered Systems
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23-5 (SOT-25)
Mounting Method:
Surface Mount