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Manufacturer Part #
MCP6V71T-E/OT
SINGLE, ZERO-DRIFT OP AMP, E TEMP
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Std. Mfr. Pkg Package Style:SOT-23-5 (SOT-25) Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP6V71T-E/OT - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.
***UPDATE OF PCN113107***Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP4014, MCP4024, MCP6421, MCP6471, MCP6481, MCP6491, MCP6V11xx, MCP6V16xx, MCP6V31xx, MCP6V36xx, MCP6V61xx, MCP6V66xx, MCP6V71xx, MCP6V76xx, MCP6V81xx, MCP6V86xx, MCP6V91xx, MCP6V96xx, MCP73811, MCP73812, MCP73831, MCP73832, MCP9501, MCP9502, MCP9503, MCP9504, MCP9509, MCP9800, MCP9802 and MIC333 device families in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new bond wire material.Estimated First Ship Date: 08 July 2025 (date code: 2528)Revision History: May 16, 2025: Issued final notification.May 22, 2025: Re-issued final notification to update the Qualification Report.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP4014, MCP4024, MCP6421, MCP6471, MCP6481, MCP6491, MCP6V11xx, MCP6V16xx, MCP6V31xx, MCP6V36xx, MCP6V61xx, MCP6V66xx, MCP6V71xx, MCP6V76xx, MCP6V81xx, MCP6V86xx, MCP6V91xx, MCP6V96xx, MCP73811, MCP73812, MCP73831, MCP73832, MCP9501, MCP9502, MCP9503, MCP9504, MCP9509, MCP9800, MCP9802 and MIC333 device families in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new bond wire material.Estimated First Ship Date: 08 July 2025 (date code: 2528)
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8006NS as a new die attach material for selected 24AA0x, 24C01C, 24LC0x, 24VL0x, 25AA0x, 25LC0x, 34AA02, 34LC02, 34VL02, 93AAx, 93C46x, 93C56x, 93C66x, 93C76x, 93C86x, 93LCx, MCP64x, MCP6V1x, MCP6V3x, MCP6V6x, MCP6V7x, MCP6V8x, MCP6V9x, MCP9x, MTCH101, PIC10F20x, PIC10F22x, device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8006NS as a new die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:05 December 2024 (date code: 2449)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 93LCxxx, 93AAxxx, 93Cxxx, PIC10F2xx, 25LC0xxx, 25AA0xxx, MTCH101,24VL0xx, 24LC0xx, 24AA0xxx, 24C01C, 34VL02, 34LC02, 34AA02, MCP40xx, MCP9800xx, MCP9802xx, MCP738xx, MCP950xx, MCP6Vxxx, and MCP64xx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Part Status:
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Microchip MCP6V71T-E/OT - Technical Attributes
| No of Channels: | 1 |
| Slew Rate-Nom: | 1V/µs |
| Input Offset Voltage-Max: | 8µV |
| Package Style: | SOT-23-5 (SOT-25) |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3000 per Std. Mfr. Pkg
Package Style:
SOT-23-5 (SOT-25)
Mounting Method:
Surface Mount