Manufacturer Part #
TC7106CLW
TC7106 Series 9 V 7-Segment 3-1/2 Digit Analog-to-Digital Converter - PLCC-44
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:27 per Tube Package Style:PLCC-44 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip TC7106CLW - Product Specification
Shipping Information:
ECCN:
PCN Information:
***UPDATE OF PCN110995, PCN111020, PCN116766***Revision History: February 20, 2025: Issued initial notification.February 21, 2025: Re-issued initial notification to update the qualification plan. October 17, 2025: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on November 20, 2025. October 23, 2025: Re-issued final notification to update pre and post change table to "wafer size". Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for TC7107, TC7107A, TC7106, TC7106A, TC7660, TC1044S, TC623, TC682, TC7116, TC514, TC7662B, TC7117, TC510, TC4431, TC4432, TC624, TC7117A, TC7116A, TC7660S, TC7129 and TC7660H device families of 40K and 42K technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Estimated First Ship Date: 20 November 2025 (date code: 2547)
***UPDATE OF PCN110995 & PCN111020***Revision History: February 20, 2025: Issued initial notification.February 21, 2025: Re-issued initial notification to update the qualification plan. October 17, 2025: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on November 20, 2025. Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for TC7107, TC7107A, TC7106, TC7106A, TC7660, TC1044S, TC623, TC682, TC7116, TC514, TC7662B, TC7117, TC510, TC4431, TC4432, TC624, TC7117A, TC7116A, TC7660S, TC7129 and TC7660H device families of 40K and 42K technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiry.Estimated First Ship Date: 20 November 2025 (date code: 2547)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for TC7107, TC7107A, TC7106, TC7106A, TC7660, TC1044S, TC623, TC682, TC7116, TC514, TC7662B, TC7117, TC510, TC4431, TC4432, TC624, TC7117A, TC7116A, TC7660S, TC7129 and TC7660H device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file calledTempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: August 2025Revision History: February 20, 2025: Issued initial notification.February 21, 2025: Re-issued initial notification to update the qualification plan.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for TC7107, TC7107A, TC7106, TC7106A, TC7660, TC1044S, TC623, TC682, TC7116, TC514, TC7662B, TC7117, TC510, TC4431, TC4432, TC624, TC7117A, TC7116A, TC7660S, TC7129 and TC7660H device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2 (TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Microchip has released a new Datasheet for the TC7106 Family Data Sheet of devices. Notification Status: FinalDescription of Change:Revision EThe following is the list of modifications:1. Updated Package Type section.2. Minor typographical errors.Impacts to Data Sheet: See above details.Reason for Change: To Improve Productivity.Change Implementation Status: CompleteDate Document Changes Effective: 02 Aug 2024
Part Status:
Microchip TC7106CLW - Technical Attributes
| Interface: | Parallel |
| No of Channels: | 1 |
| Supply Voltage: | 9V |
| Rated Current: | 800µA |
| Operating Temp Range: | 0°C to 70°C |
| Storage Temperature Range: | -65°C to +150°C |
| Package Style: | PLCC-44 |
| Mounting Method: | Surface Mount |
Features & Applications
The TC7106CLW is a part of TC7106 Series Analog to Digital Converter. It can sustain a temperature ranging from -25 to +85°C, It comes in 44 pin PLCC package.
The TC7106 3-1/2 digit direct-display drive analog-to-digital converters allow existing 7106/7107 based systems to be upgraded. Each device has a precision reference with a 20ppm/°C max temperature coefficient. This represents a 4 to 7 times improvement over similar 3-1/2 digit converters.
Features:
- Internal Reference with Low Temperature Drift:
- TC7106/TC7107: 80 ppm/°C (Typical)
- Drives LCD (TC7106) or LED (TC7107) Display Directly
- Zero Reading with Zero Input
- Low Noise for Stable Display
- Auto-Zero Cycle Eliminates Need for Zero Adjustment
- True Polarity Indication for Precision Null Applications
- Convenient 9 V Battery Operation (TC7106A)
- High-Impedance CMOS Differential Inputs: 1012Ω
- Differential Reference Inputs Simplify Ratiometric Measurements
- Low-Power Operation: 10 mW
Applications:
- Thermometry
- Bridge Readouts: Strain Gauges, Load Cells, Null Detectors
- Digital Meters: Voltage/Current/Ohms/Power, pH
- Digital Scales, Process Monitors
- Portable Instrumentation
Available Packaging
Package Qty:
27 per Tube
Package Style:
PLCC-44
Mounting Method:
Surface Mount