Manufacturer Part #
MCP2030-I/SL
MCP2030 Series 3.6 V 10 Kb/s 125 KHz 3-Channel Analog Front-End Device - SOIC-14
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:57 per Tube Package Style:SOIC-14 Mounting Method:Surface Mount | ||||||||||
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Microchip MCP2030-I/SL - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 120K and 121K wafer technologies available in 14L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxy or Gold wire and 8390A die attach epoxy.Reason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Microchip MCP2030-I/SL - Technical Attributes
| No of Channels: | 3 |
| Interface: | Analog |
| Supply Voltage: | 2V to 3.6V |
| Package Style: | SOIC-14 |
| Mounting Method: | Surface Mount |
Features & Applications
The MCP2030-I/SL is a stand-alone Analog Front-End (AFE) device for Low-Frequency (LF) sensing and bidirectional communication applications.
The device is optimized for very low current consumption and has various battery-saving low-power modes (Sleep, Standby, Active).
Features:
- Three input pins for analog input signals
- High input detection sensitivity (3 mVPP, typical)
- High modulation depth sensitivity (as low as 8%)
- Three output selections:
- Demodulated data
- Carrier clock
- RSSI
- Input carrier frequency: 125 kHz, typical
- Input data rate: 10 Kbps, maximum
- 8 internal Configuration registers
- Bidirectional transponder communication (LF talk back)
- Programmable antenna tuning capacitance (up to 63 pF, 1 pF/step)
- Programmable output enable filter
- Low standby current: 4 μA (with 3 channels enabled), typical
- Low operating current: 13 μA (with 3 channels enabled), typical
Applications:
- Automotive industry applications:
- Passive Keyless Entry (PKE) transponder
- Remote door locks and gate openers
- Engine immobilizer
- LF initiator sensor for tire pressure monitoring systems
- Security Industry applications:
- Long range access control transponder
- Parking lot entry transponder
- Hands-free apartment door access
- Asset control and management
Available Packaging
Package Qty:
57 per Tube
Package Style:
SOIC-14
Mounting Method:
Surface Mount