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Manufacturer Part #
MCP42010T-I/SL
MCP42 Series Dual 8-Bit 256 Step SPI 10 kOhm Volatile Digital POT-SOIC-14
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:2600 per Reel Package Style:SOIC-14 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP42010T-I/SL - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 120K and 121K wafer technologies available in 14L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxy or Gold wire and 8390A die attach epoxy.Reason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Microchip MCP42010T-I/SL - Technical Attributes
| No of Positions: | 256 |
| No of Channels: | 2 |
| Interface: | SPI |
| Wiper Storage: | Volatile |
| Resistance: | 10kΩ |
| Tolerance: | ±20% |
| Supply Voltage: | 2.7V to 5.5V |
| Package Style: | SOIC-14 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
2600 per Reel
Package Style:
SOIC-14
Mounting Method:
Surface Mount