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Manufacturer Part #
MIC4225YM-TR
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2500 per Reel
SOIC-8
Surface Mount
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Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material, G700LTD as a new mold compound material and 8303A as a new die attach material for selected MIC2012, MIC2025, MIC2026, MIC2042, MIC2043, MIC2075, MIC2076, MIC2172, MIC2536, MIC2544, MIC2544A, MIC2545A, MIC2548, MIC2548A, MIC2549A, MIC2582, MIC2587, MIC29201, MIC29204, MIC2951, MIC2954, MIC3172, MIC3203, MIC38C42, MIC38C43, MIC38C44, MIC38C45, MIC38HC42, MIC38HC43, MIC38HC44, MIC38HC45, MIC4223, MIC4224, MIC4225, MIC4801, MIC5014, MIC5015, MIC5020, MIC5021, MIC5156, MIC5200, MIC5201 and MIC5202 device families available in 8L SOIC (.150in) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material, G700LTD as a new mold compound material and 8303A as a new die attach material.
*** Update for PCN 111554 ***Revision History: March 19, 2025: Issued initial notification.December 17, 2025: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on January 14, 2026. Added column "Change (Yes/No)" in the pre and post change table. Updated part list to add 2A827 and MIC69303RTYME-HP_ASSY and remove MIC69303RTSGC-E, MIC69303RTSGC-MQ, MIC69303RTSGC-SV and MIC69303RTYME HP catalog part numbers (CPN). Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected 161-699102, MAQ3203, MIC21xx, MIC22xx, MIC25xx, MIC32xx, MIC422x, MIC44Fxx, MIC682xx, MIC68400, MIC68401, MIC691xx, MIC6930, MIC69502, MIC79110 and MIC920 device families of 2AK (BCD12) technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status: In ProgressEstimated First Ship Date: 14 January 2026 (date code: 2603)
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected 161-699102, MAQ3203, MIC21xx, MIC22xx, MIC25xx, MIC32xx,MIC422x, MIC44Fxx, MIC682xx, MIC68400, MIC68401, MIC691xx, MIC6930, MIC69502, MIC79110 and MIC920 device families of 2AK (BCD12) technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Part Status:
The MIC4225YM TR is a part of MIC422x series dual 4 A, High-Speed, Low-side MOSFET driver with logic-level driver enable.
The devices are fabricated on Micrel’s Bipolar/CMOS/DMOS (BCD) process and operate from a 4.5 V to 18 V supply voltage. The devices parallel Bipolar and CMOS output stage architecture provides high-current throughout the MOSFETs Miller Region allowing the driver to sink and source 4A of peak current from a 12 V supply and quickly charge and discharge a 2000 pF load capacitance in under 15ns, while allowing the outputs to swing within 0.3 V of V DD and 0.16V of ground.
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.