Manufacturer Part #
TC427MJA
TC427 Series 1.5 A 18 Vmax Dual Low Side Non Inverting MOSFET Driver - CERDIP-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:56 per Tube Package Style:CERDIP-8 Mounting Method:Through Hole | ||||||||||
| Date Code: | |||||||||||
Microchip TC427MJA - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 110961 ***Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2(TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO ? Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 30 September 2025 (date code: 2540)Revision History: February 19, 2025: Issued initial notification.September 04, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 30, 2025.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO ? Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: July 2025Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2(TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Part Status:
Microchip TC427MJA - Technical Attributes
| Configuration: | Low Side |
| No of Outputs: | Dual |
| Output Impedance: | 6Ω |
| Peak Output Current: | 1.5A |
| Supply Voltage-Max: | 18V |
| Package Style: | CERDIP-8 |
| Mounting Method: | Through Hole |
Features & Applications
Features:
- High-Speed Switching (CL = 1000pF): 30nsec
- High Output Voltage Swing
- VDD -25mV
- GND +25mV
- Low Input Current (Logic "0" or "1"): 1μA
- TTL/CMOS Input Compatible
- Available in Inverting and Noninverting Configurations
- Wide Operating Supply Voltage: 4.5 V to 18 V
- Current Consumption
- Inputs Low – 0.4mA
- Inputs High – 8mA
- Single Supply Operation
- Low Output Impedance: 6Ω
- Pinout Equivalent of DS0026 and MMH0026
- Latch-Up Resistant: Withstands > 500mA Reverse Current
- ESD Protected: 2kV
Applications:
- Switch Mode Power Supplies
- Clock Line Driver
- Pulse Transformer Drive
- Coax Cable Driver
Available Packaging
Package Qty:
56 per Tube
Package Style:
CERDIP-8
Mounting Method:
Through Hole