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Manufacturer Part #
MCP16251T-I/MNY
LOW IQ BOOST SWITCHING REGULATOR, TRUE OUTPUT DISCONNECT
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Reel Package Style:TDFN-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP16251T-I/MNY - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of Microchip Technology Gresham – Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file calledTempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe – Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: October 2025
****FPCN108254 UPDATE****Description of Change: Qualification of MMT as an additional assembly site for MCP6V03T-E/MNY, MCP6232T-E/MNY, MCP6V06T-E/MNY, MCP6V08T-E/MNY, MCP6V01T-E/MNY, MCP6052T-E/MNY, MCP6062T-E/MNY, MCP6402T-E/MNY, MCP6072T-E/MNY, MCP651T-E/MNY, MCP6051T-E/MNY, MCP6071T-E/MNY, MCP6061T-E/MNY, MCP661T-E/MNY, MCP6442T-E/MNY, MCP621T-E/MNY, MCP631T-E/MNY, MCP6V28T-E/MNY, MCP6V26T-E/MNY, MCP16251T-I/MNY, MCP16252T-I/MNY catalog part numbers (CPN) available in 8L TDFN (2x3x0.8mm) package.Reason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Description of Change: Qualification of MMT as an additional assembly site for MCP6V03T-E/MNY, MCP6232T-E/MNY, MCP6V06T-E/MNY, MCP6V08T-E/MNY, MCP6V01T-E/MNY, MCP6052T-E/MNY, MCP6062T-E/MNY, MCP6402T-E/MNY, MCP6072T-E/MNY, MCP651T-E/MNY, MCP6051T-E/MNY, MCP6071T-E/MNY, MCP6061T-E/MNY, MCP661T-E/MNY, MCP6442T-E/MNY, MCP621T-E/MNY, MCP631T-E/MNY, MCP6V28T-E/MNY, MCP6V26T-E/MNY, MCP16251T-I/MNY, MCP16252T-I/MNY catalog part numbers (CPN) available in 8L TDFN (2x3x0.8mm) package.Reason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
Part Status:
Microchip MCP16251T-I/MNY - Technical Attributes
| Package Style: | TDFN-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3300 per Reel
Package Style:
TDFN-8
Mounting Method:
Surface Mount