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Manufacturer Part #
MIC5225-3.0YM5-TR
HIGH VIN, LOW IQ REGULATOR
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Reel Package Style:SOT-23 (SC-59,TO-236) Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MIC5225-3.0YM5-TR - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for MIC5207, MIC5209, MM5450, MM5451, MIC38C44, MIC38C45, MIC38C42, MIC38C43, MIC5233, MIC5205, MIC5235, MIC5219, MIC5225, MIC4684, MIC5239, MIC5236, MIC5234,MIC5238, MIC5210, MIC79050, MIC5212, MIC5201, MIC3490, MIC4685, MIC5295, MIC4680, and MIC5237 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2 (TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of G700 as a new mold compound material for selected Micrel MIC3490, MIC52xx, MIC62xxxM5, SPN020xxxx device families available in 5L SOT-23 package assembled at STAR assembly site.Reason for Change:To improve manufacturability by qualifying G700 mold compound material and DAP surface prep.Change Implementation Status:In ProgressEstimated First Ship Date:November 15, 2022 (date code: 2247)
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of G700 as a new mold compound material for selected Micrel MIC3490, MIC52xx, MIC62xxxM5, SPN020xxxx device families available in 5L SOT-23 package assembled at STAR assembly site.Reason for Change:To improve manufacturability by qualifying G700 mold compound material and DAP surface prep.Change Implementation Status:In ProgressEstimated First Ship Date:November 15, 2022 (date code: 2247)
PCN Status:Initial NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of G700 as a new mold compound material and DAP surface prep for selected Micrel MIC3490, MIC52xx, MIC62xxxM5, SPN020xxxx device families available in 5L SOT-23 package assembled at STAR assembly site.Impacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying G700 mold compound material and DAP surface prep.Change Implementation Status:In ProgressEstimated Qualification Completion Date:May 2022
Part Status:
Microchip MIC5225-3.0YM5-TR - Technical Attributes
| Package Style: | SOT-23 (SC-59,TO-236) |
| Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23 (SC-59,TO-236)
Mounting Method:
Surface Mount