Manufacturer Part #
MIC2004-0.5YML-TR
MIC2004 Series 1 Channel 5.5 V 500mA High Side Power Distribution Switch - MLF-6
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:5000 per Reel Package Style:MLF-6 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MIC2004-0.5YML-TR - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
*****FPCN111595 UPDATE/LOCATION CHANGE*****Description of Change:August 18, 2025: Issued final notification. Attached the Qualification Report. Provided the estimatedfirst ship date to be on October 29, 2025Fabrication Site:OLD- Microchip Technology Tempe ? Fab 2(TMGR)NEW- Microchip Technology Colorado (MCSO)Wafer SizeOLD- 8"NEW- 6"
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in various packages.Reason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2025
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Description of Change:Qualification of UNIG as a new final test site for selected MIC200x, MIC201x, MIC28xx, Y30442D and MIC300x device families available in various packages using Tube and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Description of Change:Qualification of UNIG as a new final test site for selected MIC200x, MIC201x, MIC28xx, Y30442D and MIC300x device families available in various packages using Tube and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Part Status:
Microchip MIC2004-0.5YML-TR - Technical Attributes
| Configuration: | High Side |
| Input Voltage: | 2.5V to 5.5V |
| No of Elements: | Single |
| On-state Resistance-Max: | 100mΩ |
| Rated Current-Max: | 0.5A |
| Type: | Power Distribution Switch |
| Package Style: | MLF-6 |
| Mounting Method: | Surface Mount |
Features & Applications
MIC2004-0.5YML TR and MIC2014 are current limiting, high-side power switches, designed for general purpose power distribution and control in PCs, PDAs, printers and other self-powered systems. MIC2004 and MIC2014’s primary functions are current limiting and power switching. They are thermally protected and will shutdown should their internal temperature reach unsafe levels, protecting both the device and the load, under high current or fault conditions.
MIC2004/2014 feature a load discharge FET which ensures any output capacitance is discharged when the switch is turned off. This is particularly useful in hot-swapping applications where ‘cold’ connections are desired. Both devices are fully self-contained, with the current limit value being factory set to one of several convenient levels. MIC2014 offers a unique new feature: Kickstart™, which allows momentary high current surges to pass unrestricted without sacrificing overall system safety. MIC2004 and MIC2014 are excellent choices for USB and IEEE 1394 (FireWire) applications or for any system where current limiting and power control are desired. The MIC2004 and MIC2014 are offered in space saving 6 pin SOT-23 and 2 mm x 2 mm MLF packages.
Key Features:
- 70 mO typical on-resistance
- 2.5 V - 5.5 V operating range
- Pre-set current limit values; 0.5 A, 0.8 A and 1.2 A
- Load discharge FET
- Kickstart™ allows momentary current surges before the onset of current limiting
- Thermal Protection
- Under voltage lock-out
- Low quiescent current
- Operating temperatures from –40 °C to +85 °C
- ESD protection
- UL certification, file number E179633
Applications:
- USB / IEEE 1394 Power Distribution
- Desktop and Laptop PCs
- Satellite / cable / DVR set top boxes
- PDAs
- Printers
- Docking stations
- Chargers and docking stations
- Game consoles
To learn more about the MIC2004-0.5YML TR product family, Click Here.
Available Packaging
Package Qty:
5000 per Reel
Package Style:
MLF-6
Mounting Method:
Surface Mount