Pays de livraison
Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
Pays sélectionné
Référence fabricant
BU30TD3WG-TR
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3000 par Reel
SSOP-5
Surface Mount
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Title of change Change in wafer factory from ROHM Headquarters to ROHM Apollo Chikugo and change in packaging materials due to production base reorganization.Detailed description of changeBeforeFront-End Process: ROHM Headquarters 0.35m CMOS.Back-End Process: See Attachment.AfterFront-End Process:ROHM Apollo Chikugo 0.35m CMOS.Wire material change models feature thicker PAD metal.Back-End Process: See Attachment.Reason for change We will restructure low-utilization, small-scale production lines and standardize materials to advance structural reforms that ensure a stable supply to our customers over the long term.Planned first ship date September 30, 2026Sample available schedule: March 2, 2026
Statut du produit:
It has excellent noise characteristics and load responsiveness characteristics despite its low circuit current consumption of 35 µA. It is most appropriate for various applications such as power supplies for logic Ic, RF, and camera modules.
Features:
Applications:
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
