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Manufacturer Part #
MIC5219-3.3YML-TR
500MA PEAK 1% LOW NOISE LDO
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:5000 per Reel Package Style:MLF-6 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MIC5219-3.3YML-TR - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
Description of Change: Qualification of UNIG as an additional final test site and scan and pack site for selected MIC5319, MIC2009, MIC2005, MIC5219, MIC47050, MIC5305, MIC5259, MIC5252, MIC5255, MIC5232 and MIC5247 device families available in 6L VDFN (2x2x0.9mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying UNIG as an additional final test site and scan and pack site.
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
***UPDATE OF PCN110834***Description of Change: CCB 7364.004 Final Notice: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected LM4040, LM4041, MIC23158, MIC23159, MIC38C42, MIC38C43, MIC38C44, MIC38C45, MIC4043, MIC4680, MIC4681, MIC4682, MIC4684, MIC4685, MIC4690, MIC5201, MIC5203, MIC5205, MIC5206, MIC5207, MIC5208, MIC5209, MIC5210, MIC5211, MIC5212, MIC5213, MIC5216, MIC5219, MIC5234, MIC5236, MIC5237, MIC5238, MIC5239, MIC5270, MIC5271, MIC6211, MIC6270, MIC79050, MM5450 and MM5451 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for MIC5207, MIC5209, MM5450, MM5451, MIC38C44, MIC38C45, MIC38C42, MIC38C43, MIC5233, MIC5205, MIC5235, MIC5219, MIC5225, MIC4684, MIC5239, MIC5236, MIC5234,MIC5238, MIC5210, MIC79050, MIC5212, MIC5201, MIC3490, MIC4685, MIC5295, MIC4680, and MIC5237 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2 (TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MIC5219-3.3YML-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--analog--regulators-reference--linear-regulators/mic5219-3-3yml-tr-microchip-1467745
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MIC5219-3.3YML-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--analog--regulators-reference--linear-regulators/mic5219-3-3yml-tr-microchip-1467745
Microchip MIC5219-3.3YML-TR - Technical Attributes
| Input Voltage-Min: | 2.5V |
| Input Voltage-Max: | 12V |
| Output Voltage Fixed: | 3.3V |
| Dropout Voltage-Max: | 500mV |
| Output Current-Max: | 500mA |
| Package Style: | MLF-6 |
| Mounting Method: | Surface Mount |
Features & Applications
This device comes with high peak output current capability and very-low-dropout voltage and better than 1% output voltage accuracy. It is designed to provide a peak output current for start-up conditions where higher inrush current is demanded.
Features:
- 500 mA output current capability
- 2 mm×2 mm MLF package - 500 mA continuous
- Low 500mV maximum dropout voltage at full load
- Extremely tight load and line regulation
- Tiny SOT-23-5 and MM8™ power MSOP-8 package
- Ultra-low-noise output
- Low temperature coefficient
- Current and thermal limiting
- Reversed-battery protection
- CMOS/TTL-compatible enable/shutdown control
- Near-zero shutdown current
Applications:
- Laptop, notebook, and palmtop computers
- Cellular telephones and battery-powered equipment
- Consumer and personal electronics
- PC Card VCC and VPP regulation and switching
- SMPS post-regulator/DC-to-DC modules
- High-efficiency linear power supplies
Available Packaging
Package Qty:
5000 per Reel
Package Style:
MLF-6
Mounting Method:
Surface Mount