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Manufacturer Part #
TC1071VCT713
TC1071 Series 100 mA 0.8 to 5.5 V ADJ Ouput LDO Regulator w/ Shutdown - SOT-23-5
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Reel Package Style:SOT-23-5 (SOT-25) Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip TC1071VCT713 - Product Specification
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PCN Information:
Description of Change: Qualification of Microchip Technology Gresham – Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file calledTempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe – Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: October 2025
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP13xx, MCP1824, MCP3021Axx, MCP3221Axx, MCP6xx, TC10xx,TC118xx, TC122xx, TC20xx, TC218xx and TC74Axx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Microchip has released a new Datasheet for the TC1070/TC1071/TC1187 - 50 mA, 100 mA and 150 mA Adjustable CMOS LDOs with Shutdown of devices. Notification Status: FinalDescription of Change: • Added automotive qualification to “Features” and examples to “Product Identification System”.• Added values for ESD protection to “Absolute Maximum Ratings†”.• Updated 6.0 “Packaging Information”.• Made minor text and format changes throughout.Impacts to Data Sheet: NoneReason for change: To Improve Productivity.Change Implementation Status: CompleteDate Document Changes Effective: 26 Jul 2023
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP13xx, MCP1824, MCP3021Axx, MCP3221Axx, MCP6xx, TC10xx, TC118xx, TC122xx, TC20xx, TC218xx and TC74Axx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Part Status:
Microchip TC1071VCT713 - Technical Attributes
| Input Voltage-Min: | 2.7V |
| Input Voltage-Max: | 6V |
| Output Voltage Range: | 1.2V to 5.5V |
| Output Voltage Fixed: | 0.8V/5.5V |
| Dropout Voltage-Max: | 250mV |
| Output Current-Max: | 100mA |
| Rated Power: | 390.6mW |
| Operating Temp Range: | -40°C to +125°C |
| Regulator Topology: | Adjustable |
| No. of Outputs: | Single |
| Output Noise: | 260V |
| Load Regulation (%): | 2% |
| Line Regulation (%): | 0.35% |
| Package Style: | SOT-23-5 (SOT-25) |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23-5 (SOT-25)
Mounting Method:
Surface Mount