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Manufacturer Part #
LX34050QPW
LX34050 Series 6V Gull Wing High Speed Inductive Position Sensor IC - TSSOP-14
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:96 per Tube Package Style:TSSOP-14 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2136 | ||||||||||
Microchip LX34050QPW - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
*** Update for PCN 110952 ***Description of Change: Qualification of 8008MD as a new die attach material for selected LX34070, LX3302A, LX34050 and LX34311 device families available in 14L TSSOP (4.4mm) package.Reason for Change: To improved manufacturability by qualifying 8008MD as a new die attach material.Estimated First Ship Date: 15 July 2025 (date code: 2529)Revision History: September 18, 2024: Issued initial notification.September 19, 2024: Re-issued initial PCN to correct the die attach pre-change material from 3280 to 2200D.November 08, 2024: Re-issued initial PCN to update affected parts list to add CPN LX3302AQPW-TR-C01 and remove LX34211QPW-TR, LX34211QPW-TR-VAO, LX3301AQPW and LX3301AQPW-TR catalog part numbers. Revised "Notification Subject", "Description of Change" and “Qualification Plan” title to reflect the removed parts numbers. Updated Pre and Post Change Summary table to include Lead-frame paddle size and DAP Surface Prep. Added Pre and post change comparison for the Lead-frame drawing. February 19, 2025: Re-issued initial PCN. Updated Pre and Post Change Summary table by removing the Lead-frame paddle size and DAP Surface Prep, as there no changes to these. Removed Pre and post change comparison for the Lead-frame drawing. Updated the affected parts list. June 06, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on July 15, 2025.
Description of Change: Qualification of 8008MD as a new die attach material for selected LX34070, LX3302A, LX34050 and LX34311 device families available in 14L TSSOP (4.4mm) package.Reason for Change: To improved manufacturability by qualifying 8008MD as a new die attach material.Estimated Qualification Completion Date:December 2024Revision History: September 18, 2024: Issued initial notification.September 19, 2024: Re-issued initial PCN to correct the die attach pre-change material from 3280 to 2200D.November 08, 2024: Re-issued initial PCN to update affected parts list to add CPN LX3302AQPW-TR-C01 and remove LX34211QPW-TR, LX34211QPW-TR-VAO, LX3301AQPW and LX3301AQPW-TR catalog part numbers. Revised "Notification Subject", "Description of Change" and “Qualification Plan” title to reflect the removed parts numbers. Updated Pre and Post Change Summary table to include Lead-frame paddle size and DAP Surface Prep. Added Pre and post change comparison for the Lead-frame drawing. February 19, 2025: Re-issued initial PCN. Updated Pre and Post Change Summary table by removing the Lead-frame paddle size and DAP Surface Prep, as there no changes to these. Removed Pre and post change comparison for the Lead-frame drawing. Updated the affected parts list.
PCN Status:Initial NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of Microchip Technology Tempe ? Fab 2 as an additional fab site for selected LX3302A and LX34050 device families available in 14L TSSOP (4.4mm) package.Reason for Change:To improve manufacturability by qualifying Microchip Technology Tempe ? Fab 2 (TGMR) as an additional fab location.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2023 (2339)
Part Status:
Microchip LX34050QPW - Technical Attributes
| Type: | Linear |
| Output Type: | Linear |
| Supply Voltage: | 4V to 6V |
| Operating Temp Range: | -40°C to +150°C |
| Package Style: | TSSOP-14 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
96 per Tube
Package Style:
TSSOP-14
Mounting Method:
Surface Mount
