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Manufacturer Part #
TC653BEVUA
TC653 Series 5.5 V Digital Integrated Temperature Sensor - MSOP-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:100 per Tube Mounting Method:Surface Mount | ||||||||||
| Date Code: | 1727 | ||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:November 28, 2017: Issued initial notification.December 22, 2017: Re-issued initial notification to correct the Pre and Post Change summary from CuPdAu wire to Au wire.May 23, 2018: Issued final notification. Attached the Qualification Report. Revised the affected parts list. Provided estimated first ship date on June 23, 2018.July 09, 2018: Resend PCN to update qual report title.Description of Change:Qualification of MMT as an additional assembly site for selected products available in 8L MSOP package using gold (Au) bond wire.Pre Change: Assembled at MTAI assembly site.Post Change: Assembled at MTAI or MMT assembly site.Reason for Change:To improve productivity by qualifying MMT as an additional assembly site.Estimated First Ship Date: June 23, 2018 (date code: 1825)
Description of Change:Qualification of MMT as an additional assembly site for selected products available in 8L MSOP package using gold (Au) bond wire.Pre Change:Assembled at MTAI assembly site.Post Change:Assembled at MTAI or MMT assembly site.Reason for Change:To improve productivity by qualifying MMT as an additional assembly site.Estimated First Ship Date:June 23, 2018 (date code: 1825)
Description of Change:Qualification of MMT as an additional assembly site for selected products available in 8L MSOP package using gold (Au) bond wire.Pre Change:Assembled at MTAI assembly site.Post Change:Assembled at MTAI or MMT assembly site.Reason for Change:To improve productivity by qualifying MMT as an additional assembly site.Estimated Qualification Completion Date:January 2018
Description of Change:Qualification of MMT as an additional assembly site for selected products available in 8L MSOP package using gold (Au) bond wire.Pre Change: Assembled at MTAI assembly site.Post Change:Assembled at MTAI or MMT assembly site.Reason for Change:To improve productivity by qualifying MMT as an additional assembly site.Estimated Qualification Completion Date:January 2018
Description of Change:Qualification of MMT as an additional assembly site for selected products available in 8L MSOP package using gold (Au) bond wire.Pre Change: Assembled at MTAI assembly site.Post Change:Assembled at MTAI or MMT assembly site.Reason for Change:To improve productivity by qualifying MMT as an additional assembly site.Estimated Qualification Completion Date:January 2018
Product Lifecycle:
-
ROHS Compliant -
Lead Free
Technical Attributes
| Output Type: | Digital |
| Supply Voltage: | 2.8V to 5.5V |
| Operating Temp Range: | -40°C to +125°C |
| Interface Type: | Logic |
| Mounting Method: | Surface Mount |
Features & Applications
Features:
- Integrated Temperature Sensing and Multi-speed Fan Control
- FanSense™ Fan Fault Detect Circuitry
- Built-in Over-Temperature Alert (TOVER)
- Temperature Proportional Fan Speed Control for Acoustic Noise Reduction and Longer Fan Life
- Pulse Width Modulation Output Drive for Cost and Power Savings
- Solid-State Temperature Sensing
- ±1°C (Typical) Accuracy from 25°C to +70°C
- 2.8 V – 5.5 V Operating Range
- TC653 includes Auto Fan Shutdown
- Low Operating Current: 50 μA (Typical)
Applications:
- Thermal Protection For Personal Computers
- Digital Set-Top Boxes
- Notebook Computers
- Data Communications
- Power Supplies
- Projectors
Available Packaging
Package Qty:
100 per Tube
Mounting Method:
Surface Mount
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