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Manufacturer Part #
TC653BEVUATR
TC653BE Series 5.5 V 25°C to +70°C Digital Integrated Temperature Sensor MSOP-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:2500 per Reel Package Style:MSOP-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:November 28, 2017: Issued initial notification.December 22, 2017: Re-issued initial notification to correct the Pre and Post Change summary from CuPdAu wire to Au wire.May 23, 2018: Issued final notification. Attached the Qualification Report. Revised the affected parts list. Provided estimated first ship date on June 23, 2018.July 09, 2018: Resend PCN to update qual report title.Description of Change:Qualification of MMT as an additional assembly site for selected products available in 8L MSOP package using gold (Au) bond wire.Pre Change: Assembled at MTAI assembly site.Post Change: Assembled at MTAI or MMT assembly site.Reason for Change:To improve productivity by qualifying MMT as an additional assembly site.Estimated First Ship Date: June 23, 2018 (date code: 1825)
Description of Change:Qualification of MMT as an additional assembly site for selected products available in 8L MSOP package using gold (Au) bond wire.Pre Change:Assembled at MTAI assembly site.Post Change:Assembled at MTAI or MMT assembly site.Reason for Change:To improve productivity by qualifying MMT as an additional assembly site.Estimated First Ship Date:June 23, 2018 (date code: 1825)
Description of Change:Qualification of MMT as an additional assembly site for selected products available in 8L MSOP package using gold (Au) bond wire.Pre Change:Assembled at MTAI assembly site.Post Change:Assembled at MTAI or MMT assembly site.Reason for Change:To improve productivity by qualifying MMT as an additional assembly site.Estimated Qualification Completion Date:January 2018
Description of Change:Qualification of MMT as an additional assembly site for selected products available in 8L MSOP package using gold (Au) bond wire.Pre Change: Assembled at MTAI assembly site.Post Change:Assembled at MTAI or MMT assembly site.Reason for Change:To improve productivity by qualifying MMT as an additional assembly site.Estimated Qualification Completion Date:January 2018
Description of Change:Qualification of MMT as an additional assembly site for selected products available in 8L MSOP package using gold (Au) bond wire.Pre Change: Assembled at MTAI assembly site.Post Change:Assembled at MTAI or MMT assembly site.Reason for Change:To improve productivity by qualifying MMT as an additional assembly site.Estimated Qualification Completion Date:January 2018
Product Lifecycle:
Technical Attributes
| Output Type: | Digital |
| Supply Voltage: | 2.8V to 5.5V |
| Operating Temp Range: | -40°C to +125°C |
| Interface Type: | Logic |
| Package Style: | MSOP-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
2500 per Reel
Package Style:
MSOP-8
Mounting Method:
Surface Mount
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