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Manufacturer Part #
MCP23S17-E/ML
MCP23S17 Series 5.5 V 10 MHz 16-Bit I/O Expander with Serial Interface - QFN-28
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:61 per Tube Package Style:QFN-28 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2106 | ||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um TSMC, 70nm SMIC, Vanguard,120K,130K, 150K, 160K, 165K, 200K and 290K wafer technologies in 44L, 28 QFN-S, 20L,16L and 28L QFN packages.Pre Change:Assembled at MTAI assembly site.Post Change:Assembled at MTAI or MMT assembly site.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site Estimated First Ship Date:June 24, 2018 (date code:1826)
Revision History:January 16, 2018: Issued initial notification.April 26, 2018: Issued final notification. Attached is the qualification report. Provided estimated first ship date to be on May 26, 2018. Description of Change:Qualification of MMT as an additional site for selected products of 150K and 160K wafer technologies available in 44 QFN (8x8mm), 28L QFN-S(6x6mm), 28L QFN(6x6mm), 20L QFN (4x4mm), 16L QFN((4x4mm) and 16L QFN(3x3mm) packages. Pre Change: Assembled at MTAI assembly sitePost Change: Assembled at MTAI or MMT assembly site.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Estimated First Ship Date:May 26, 2018(date code: 1821)
CCB 1475 Initial Notice: Qualification of C194 lead-frame for selected QFN and UQFN packages at NSEB assembly site.Description of Change: Qualification of C194 lead-frame for 16L QFN (4x4x0.9mm), 16L QFN (3x3x0.9mm), 20L QFN (4x4x0.9mm), 28L QFN (6x6x0.9mm), 64L QFN (9x9x0.9mm), 28L UQFN (4x4x0.5mm) and 48L UQFN (6x6x0.5mm) packages at NSEB.Pre Change: EFTEC-64T lead framePost Change: EFTEC-64T or C194 lead frameNOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Technical Attributes
| Interface Circuit Type: | SPI |
| No of Channels: | 1 |
| Clock Frequency-Max: | 10MHz |
| No of I/O Lines: | 16 |
| Supply Voltage-Nom: | 1.8V to 5.5V |
| Supply Current: | 1mA |
| Package Style: | QFN-28 |
| Mounting Method: | Surface Mount |
Features & Applications
The MCP23S17-E/ML is a Part of MCP23S17 Series 5.5 V 10 MHz 16-Bit I/O Expander with Serial Interface available in QFN-28 Surface mount Package.
This device family provides 16-bit, general purpose parallel I/O expansion for I2C bus or SPI applications.
Features:
- 16-bit remote bidirectional I/O port
- I/O pins default to input
- High-speed I2C™ interface (MCP23017)
- 100 kHz
- 400 kHz
- 1.7MHz
- High-speed SPI interface (MCP23S17)- 10 MHz (max.)
- Three hardware address pins to allow up to eight devices on the bus
- Configurable interrupt output pins
- Configurable as active-high, active-low or open-drain
- INTA and INTB can be configured to operate independently or together
- Configurable interrupt source defaults or pin changes
- Polarity Inversion register to configure the polarity of the input port data
- External Reset input
- Low standby current: 1 µA (max.)
- Operating voltage:
- 1.8V to 5.5V @ -40°C to +85°C
- 2.7V to 5.5V @ -40°C to +85°C
- 4.5V to 5.5V @ -40°C to +125°C
Available Packaging
Package Qty:
61 per Tube
Package Style:
QFN-28
Mounting Method:
Surface Mount
