Manufacturer Part #
MCP23S18-E/SO
MCP23S18 Series 5.5 V 10 MHz 16-Bit I/O Expander with Open-Drain Output -SOIC-28
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:27 per Tube Package Style:SOIC-28 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2249 | ||||||||||
Microchip MCP23S18-E/SO - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:October 12, 2020: Issued initial notification.February 13, 2021: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on February 28, 2021.Description of Change:Qualification of QMI-519 die attach material for selected products available in 28L SOIC (.300in) and 18L SOIC (.300in) packages at MTAI assembly site.Pre Change:Using 3280 die attach materialPost Change:Using QMI-519 die attach materialPre and Post Change Summary: see attachedImpacts to Data Sheet: NoneChange Impact:NoneReason for Change:To improve productivity by qualifying QMI-519 die attach materialChange Implementation Status:In ProgressEstimated First Ship Date:February 28, 2021 (date code: 2110)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: see attached
PCN Status: Initial notification. Description of Change: Qualification of QMI-519 die attach material for selected products available in 28L SOIC (.300in) and 18L SOIC (.300in) packages at MTAI assembly sitePre Change:Using 3280 die attach materialPost Change:Using QMI-519 die attach materialImpacts to Data Sheet: NoneChange Impact:NoneReason for Change:To improve productivity by qualifying QMI-519 die attach materialChange Implementation Status:In ProgressEstimated Qualification Completion Date:November 2020Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Revision History:October 12, 2020: Issued initial notification.
Part Status:
Microchip MCP23S18-E/SO - Technical Attributes
| Interface Circuit Type: | SPI |
| No of Channels: | 1 |
| Clock Frequency-Max: | 10MHz |
| No of I/O Lines: | 16 |
| Supply Voltage-Nom: | 1.8V to 5.5V |
| Supply Current: | 1mA |
| Package Style: | SOIC-28 |
| Mounting Method: | Surface Mount |
Features & Applications
The MCP23S18-E/SO is a Part of MCP23S18 Series 5.5 V 10 MHz 16-Bit I/O Expander with Open Drain output available in SOIC-28 surface mount Package.
This device provides 16-bit, general purpose parallel I/O expansion for I2C bus or SPI applications.
Features:
- 16-bit remote bidirectional I/O port:
- I/O pins default to input
- Open-drain outputs:
- 5.5V tolerant
- 25 mA sink capable (per pin)
- 400 mA total
- High-speed I2C™ interface: (MCP23018)
- 100 kHz
- 400 kHz
- 3.4MHz
- High-speed SPI interface: (MCP23S18)
- 10 MHz: 2.7V ≤ VDD ≤ 5.5V
- Single hardware address pin: (MCP23018)
- Voltage input to allow up to eight devices on the bus Configurable interrupt output pins:
- Configurable as active-high, active-low or open-drain
- Configurable interrupt source:
- Interrupt-on-change from configured defaults or pin change
- Polarity inversion register to configure the polarity of the input port data
- External reset input
- Low standby current:
- 1 μA (-40°C ≤ TA ≤ +85°C)
- 6 μA (+85°C ≤ TA ≤ +125°C)
- Operating voltage:
- 1.8V to 5.5V
Available Packaging
Package Qty:
27 per Tube
Package Style:
SOIC-28
Mounting Method:
Surface Mount