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Manufacturer Part #
ZL30121GGG2V2
ZL30121 Series 3.63 V SONET/SDH Low Jitter System Synchronizer - CABGA-100
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:260 per Tray | ||||||||||
| Date Code: | |||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected MSCC products available in various packages at ASEM assembly site. Pre Change: Assembled at ASEM assembly site using palladium coated copper (PdCu) or Copper (Cu) bond wire.Post Change:Assembled at ASEM assembly site using palladium coated copper with gold flash (CuPdAu) bond wireReason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire material.Please be advised that after the estimated first ship date customers may receive pre and post change parts
CCB 3843 Final Notice: Implement Microchip Packing Changes for selected Microsemi (LCLD, VPT, TIM, WIFI) products. PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change: Implement Microchip Packing Changes for selected Microsemi products within the Microsemi subsidiaries Microsemi Solutions Sdn.Bhd. which includes formerly Voice Line Circuits and Line Drivers (LCLD), WLAN FEM, PA and LNA�s (WiFi), Audio and Voice (VPT) and Timing and Synchronization (TIM) / Zarlink/Maxim.Pre Change: Using Microsemi�s packing process. Post Change: Using Microchip�s packing process.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change: To improve productivity by standardizing the packing method as part of the integration of Microsemi and Microchip.Change Implementation Status: In ProgressEarliest Implementation Date: August 07, 2019Note: The earliest implementation date is the earliest date that we may implement any combination of the changes listed in this PCN as we will not implement any of the proposed changes prior to this date. After the earliest implementation date these changes may occur to any product over the course of many months depending on inventory levels and business conditions.
Information Notification: Integration of the Microsemi LCLD, WIFI, VPT and TIM PCN system with the Microchip PCN System for selected Microsemi LCLD, WIFI, VPT and TIM productsDescription of Change: Integration of the Microsemi LCLD, WIFI, VPT and TIM PCN system with the Microchip PCN System for selected Microsemi LCLD, WIFI, VPT and TIM products within the Microsemi subsidiaries Microsemi Solutions Sdn.Bhd. which includes formerly Voice Line Circuits and Line Drivers (LCLD), WLAN FEM, PA and LNA�s (WiFi), Audio and Voice (VPT) and Timing and Synchronization (TIM) / Zarlink/Maxim. As part of the Microsemi integration with Microchip, Microsemi will integrate from the current Product/Process Change Notification (PCN) and End of Life (EOL) Notification system to the Microchip notification system.Pre Change: Using Microsemi LCLD, WIFI, VPT and TIM PCN systemPost Change: Using Microchip PCN systemReason for Change:To support the Microsemi integration with Microchip by archiving the Microsemi LCLD, WIFI, VPT and TIM PCN system and providing customers with the Microchip PCN service for selected Microsemi LCLD, WIFI, VPT and TIM products.
Product Lifecycle:
Available Packaging
Package Qty:
260 per Tray
