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Manufacturer Part #
SY89837UMG
SY89837U Series 3.6 V 2 GHz Precision 1:8 LVPECL Fanout Buffer - MLF-32
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:60 per Tray Package Style:MLF-32 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip SY89837UMG - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected SY8929xx, SY8770xx, SY8773xx, SY6975xx, SY8953xx, SY8772xx, SY100Exx, SY8922xx, SY8920xx, SY8983xx, SY8911xx, SY8947xx, SY8954xx, SY8985xx, SY8899xx, SY8923xx, SY8987xx, SY8984xx, SY8946xx, SY8971xx, SY8980xx, SY8814xx, SY8834xx, SYCUSTxx, SY8478xx, SY5585xx, SY5862xx, SY8893xx, SY8964xx, SY8921xx, SY8890xx, SY8931xx, SY8932xx, SY8877xx, SY8411xx, SY8830xx, SY8840xx and SY8835xx device families of 2DK technology available in various packages.Wafer Size changed from 8" to 6"Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Estimated Qualification Completion Date: January 2026
Revision History: June 17, 2025: Issued initial notification.June 20, 2025: Re-issued initial notification to update the Pre and Post Change Summary attachment.June 26, 2025: Re-issued initial notification to correct the typo error in the Pre and Post Change Summary attachment.Description of Change:Qualification of MTAI as a new assembly site for selected SY55859L SY56028XR, SY56034AR, SY56572XR, SY58024U, SY58025U, SY58026U, SY58027U, SY58028U, SY58029U, SY58030U, SY58031U, SY58032U, SY58033U, SY58034U, SY58035U, SY58036U, SY58626, SY58626L, SY58627L, SY89200U, SY89202U, SY89543L, SY89544U, SY89545L, SY89546U, SY89547L, SY89837U, SY89838U, SY89846U and SY89847U device families available in 32L VQFN (5x5x0.9mm) package.Reason for Change: To improve on-time delivery performance by qualifying MTAI as a new assembly site
Revision History:June 17, 2025: Issued initial notification.June 20, 2025: Re-issued initial notification to update the Pre and Post Change Summary attachment.Description of Change:Qualification of MTAI as a new assembly site for selected SY55859L SY56028XR, SY56034AR, SY56572XR, SY58024U, SY58025U, SY58026U, SY58027U, SY58028U, SY58029U, SY58030U, SY58031U, SY58032U, SY58033U, SY58034U, SY58035U, SY58036U, SY58626, SY58626L, SY58627L, SY89200U, SY89202U, SY89543L, SY89544U, SY89545L, SY89546U, SY89547L, SY89837U, SY89838U, SY89846U and SY89847U device families available in 32L VQFN (5x5x0.9mm) package.Pre and Post Summary Changes: See attached documentImpacts to Datasheet: NoneChange Impact: NoneReason for Change: To improve on-time delivery performance by qualifying MTAI as a new assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: August 2025Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Timetable Summary: See attached document
Description of Change: Qualification of MTAI as a new assembly site for selected SY55859L SY56028XR, SY56034AR, SY56572XR, SY58024U, SY58025U, SY58026U, SY58027U, SY58028U, SY58029U, SY58030U, SY58031U, SY58032U, SY58033U, SY58034U, SY58035U, SY58036U, SY58626, SY58626L, SY58627L, SY89200U, SY89202U, SY89543L, SY89544U, SY89545L, SY89546U, SY89547L, SY89837U, SY89838U, SY89846U and SY89847U device families available in 32L VQFN (5x5x0.9mm) package.Reason for Change: To improve on-time delivery performance by qualifying MTAI as a new assembly site
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
**Update to previous FPCN 98050******Revise affected parts list to remove SY89829UHY, SY89829UHY-TR and SY55856UHG catalog part number since these parts were EOL?ed****Description of Change:Qualification of UNIG as a new final test site for various products available in Tube and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=SY89837UMG&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--logic--timing-solutions--high-bandwidth/sy89837umg-microchip-1305937
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=SY89837UMG&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--logic--timing-solutions--high-bandwidth/sy89837umg-microchip-1305937
Microchip SY89837UMG - Technical Attributes
| Input Voltage-Max: | 4V |
| Temperature Range: | -40°C to +85°C |
| Supply Voltage-Nom: | 2.375V to 3.6V |
| Frequency-Max: | 2GHz |
| Package Style: | MLF-32 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
60 per Tray
Package Style:
MLF-32
Mounting Method:
Surface Mount