Manufacturer Part #
SY89855UMG
SY89855U Series 2.5 GHz Precision Low Power Differential LVPECL 4:1 MUX - MLF-32
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:60 per Tube Package Style:MLF-32 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip SY89855UMG - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
**Update to previous FPCN 98050******Revise affected parts list to remove SY89829UHY, SY89829UHY-TR and SY55856UHG catalog part number since these parts were EOL?ed****Description of Change:Qualification of UNIG as a new final test site for various products available in Tube and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Part Status:
Microchip SY89855UMG - Technical Attributes
| Input Voltage-Max: | 4V |
| Temperature Range: | -40°C to +85°C |
| Supply Voltage-Nom: | 2.375V to 3.6V |
| Frequency-Max: | 2.5GHz |
| Package Style: | MLF-32 |
| Mounting Method: | Surface Mount |
Features & Applications
The SY89855UMG is a precision, high speed, 4:1 differential multiplexer with 100K LVPECL (800 mV) compatible outputs. Available in surface mount MLF-32 package.
This device is part of Micrel's highspeed, Precision Edge product line and is capable of handling clocks up to 2.5 GHz and data streams up to 2.5 Gbps. In addition, a 1:2 fanout buffer provides two copies of the selected inputs.
Features:
- Select 1 of 4 differential inputs
- Provides two copies of the selected input
- Low power 260 mW (VCC = 2.5 V)
- Guaranteed AC performance over temperature and voltage:
- DC-to- >2.5 Gbps data rate throughput
- <410ps In-to-Q tpd
- <180ps tr/ tf times
- Ultra low-jitter design:
- <10psPP total jitter (clock)
- <1psRMS random jitter
- <10psPP deterministic jitter
- <0.7psRMS crosstalk-induced jitter
- Unique, patent-pending input design minimizes crosstalk
- Accepts an input signal as low as 100 mV
- Unique patented input termination and VT pin accepts DC- and AC-coupled inputs (CML, LVPECL, LVDS)
- 800 mV 100K LVPECL output swing
- Power supply 2.5 V ±5% or 3.3 V ±10%
- -40°C to +85°C temperature range
- Available in 32-pin (5mm x 5mm) QFN package
Applications:
- Redundant clock and/or data distribution
- All SONET/OC-3 to OC-48 clock/data distribution
- Loopback
- All Fibre Channel applications
- All GigE applications
Available Packaging
Package Qty:
60 per Tube
Package Style:
MLF-32
Mounting Method:
Surface Mount