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Manufacturer Part #
SY89328LMG-TR
SY89328: 3.3V TTL-to-PECL & PECL-to-TTL Translator, -40C to +85C, 8-VDFN
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1000 per Reel | ||||||||||
| Date Code: | |||||||||||
Microchip SY89328LMG-TR - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
*** Update for PCN 109504 ***Description of Change: Qualification of MTAI as a new assembly site for SY89322VMG-TR, SY89251VMG-TR, SY89250VMG-TR, SY89206VMG-TR, SY89323LMG-TR, SY89222LMG-TR, SY89329VMG-TR, SY89328LMG-TR, and SY89321LMG-TR catalog part numbers (CPN) available in 8L VDFN (2x2x0.9mm) package.Reason for Change: To improve on-time delivery performance by qualifying MTAI as a new assembly site.Estimated First Ship Date: 18 July 2025 (date code: 2529)Revision History: December 04, 2024: Issued initial notification.June 12, 20225: Issued final notification. Attached the Qualification Report. Provided the estimated first ship date to be on July 18, 2025. Revised Pre and post change table to reflect the Lead Plating change.
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
Description of Change: Qualification of MTAI as a new assembly site for SY89322VMG-TR, SY89251VMG-TR, SY89250VMG-TR, SY89206VMG-TR, SY89323LMG-TR, SY89222LMG-TR,SY89329VMG-TR, SY89328LMG-TR, and SY89321LMG-TR catalog part numbers (CPN) available in 8L VDFN (2x2x0.9mm) package.Reason for Change: To improve on-time delivery performance by qualifying MTAI as a new assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
**Update to previous FPCN 98050******Revise affected parts list to remove SY89829UHY, SY89829UHY-TR and SY55856UHG catalog part number since these parts were EOL?ed****Description of Change:Qualification of UNIG as a new final test site for various products available in Tube and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=SY89328LMG-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--logic--translators/sy89328lmg-tr-microchip-1081144
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=SY89328LMG-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--logic--translators/sy89328lmg-tr-microchip-1081144
Available Packaging
Package Qty:
1000 per Reel