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Manufacturer Part #
24AA025E48T-I/OT
24AA025E48 Series 2 Kb (256 x 8) 5.5 V 400 kHz I2C Serial EEPROM - SOT-23-6
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Reel Package Style:SOT-23-6 (SOT-26) Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2406 | ||||||||||
Microchip 24AA025E48T-I/OT - Product Specification
Shipping Information:
ECCN:
PCN Information:
***UPDATE OF PCN115155***Revision History: August 12, 2025: Issued initial notification.October 16, 2025: Issued final notification. Updated affected part list to removeDescription of Change: Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated First Ship Date: 06 November 2025 (date code: 2545)
***UPDATE OF PCN109250 & PCN111719***Description of Change: Qualification of CuPdAu as a new wire material and 8006NS as a new die attach material for selected 24AA014, 24AA025xxx, 24C01C, 24LC014, 24LC025, 24VL014, 24VL025, 25AA010A, 25AA02xx, 25AA040A, 25LC010A, 25LC020A, 25LC040A, 34AA02, 34LC02, 34VL02, MTCH101 and PIC10F2xx device families available in 6L SOT-23 package at MTAI assembly site.Reason for Change: To improve productivity by qualifying CuPdAu as a new wire material at MTAI assembly site.Estimated First Ship Date: 11 April 2025 (date code: 2515)
Description of Change: Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.
***UPDATE OF PCN112076 & PCN114907***Revision History: April 3, 2025: Issued initial notification.August 4, 2025: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on August 31, 2025. August 6, 2025: Re-issued final notification to update the attachment.Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected 24AA014, 24AA014H, 24AA024, 24AA024H, 24AA025, 24AA025E48, 24AA025E64, 24AA025UID, 24AA044, 24LC014, 24LC014H, 24LC024, 24LC024H, 24LC025, AT24C01C, AT24C02C, AT24C04C, AT24HC02C and AT24HC04B device families of 36.3K technology available various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5).Estimated First Ship Date: 31 August 2025 (date code: 2535)
***UPDATE OF PCN112076***Revision History: April 3, 2025: Issued initial notification.August 4, 2025: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on August 31, 2025.Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected 24AA014, 24AA014H, 24AA024, 24AA024H, 24AA025, 24AA025E48, 24AA025E64, 24AA025UID, 24AA044, 24LC014, 24LC014H, 24LC024, 24LC024H, 24LC025, AT24C01C, AT24C02C, AT24C04C, AT24HC02C and AT24HC04B device families of 36.3K technology available various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5).Estimated First Ship Date: 31 August 2025 (date code: 2535)
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected 24AA014, 24AA014H, 24AA024, 24AA024H, 24AA025, 24AA025E48, 24AA025E64, 24AA025UID, 24AA044, 24LC014, 24LC014H, 24LC024, 24LC024H, 24LC025, AT24C01C, AT24C02C, AT24C04C, AT24HC02C and AT24HC04B device families of 36.3K technology available various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5). Estimated Qualification Completion Date: May 2025
Description of Change: Qualification of CuPdAu as a new wire material for selected 24AA014, 24AA025, 24C01C, 24LC014, 24LC025, 24VL014, 24VL025, 25AA010A, 25AA02xx, 25AA040A,25LC010A, 25LC020A, 25LC040A, 34AA02, 34LC02, 34VL02, MTCH101 and PIC10F2xx device families available in 6L SOT-23 package at MTAI assembly site.Reason for Change: To improve productivity by qualifying CuPdAu as a new wire material at MTAI assembly site.
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8006NS as a new die attach material for selected 24AA0x, 24C01C, 24LC0x, 24VL0x, 25AA0x, 25LC0x, 34AA02, 34LC02, 34VL02, 93AAx, 93C46x, 93C56x, 93C66x, 93C76x, 93C86x, 93LCx, MCP64x, MCP6V1x, MCP6V3x, MCP6V6x, MCP6V7x, MCP6V8x, MCP6V9x, MCP9x, MTCH101, PIC10F20x, PIC10F22x, device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8006NS as a new die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:05 December 2024 (date code: 2449)
Microchip has released a new Datasheet for the 2-Kbit I2C Serial EEPROMs with EUI-48 or EUI-64 Node Identity of devices. Notification Status: FinalDescription of Change:Added automotive product offering; Updated SOT-23 package drawings.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 02 Sep 2023
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=24AA025E48T-I/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--memory--RAM--eeprom--i2c-interface-protocol/24aa025e48t-i-ot-microchip-3013332
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=24AA025E48T-I/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--memory--RAM--eeprom--i2c-interface-protocol/24aa025e48t-i-ot-microchip-3013332
Microchip 24AA025E48T-I/OT - Technical Attributes
| Memory Density: | 2kb |
| Memory Organization: | 256 x 8 |
| Supply Voltage-Nom: | 1.7V to 5.5V |
| Clock Frequency-Max: | 400kHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Data Retention: | 200 yr |
| Interface Type: | I2C |
| Access Time-Max: | 900ns |
| Operating Temp Range: | -40°C to +85°C |
| No of Terminals: | 6 |
| Package Style: | SOT-23-6 (SOT-26) |
| Mounting Method: | Surface Mount |
Features & Applications
The 24AA025E48T-I/OT is a 2 kbit EEPROM, organized as two blocks of 128 x 8-bit memory with a 2-wire serial interface, available in SOT-23 package.
Features:
- Pre-programmed Globally Unique, 48-bit Node Address
- Compatible with EUI-48™ and EUI-64™
- Single Supply with Operation Down to 1.7 V
- Low-Power CMOS Technology:
- Read current 1 mA, max.
- Standby current 1 µA, max.
- 2-Wire Serial Interface, I2C™ Compatible
- Schmitt Trigger Inputs for Noise Suppression
- Output Slope Control to Eliminate Ground Bounce
- 100 kHz and 400 kHz Clock Compatibility
- Page Write Time 3 ms, typical
- Self-Timed Erase/Write Cycle
- Page Write Buffer: 16-byte page
- ESD Protection >4,000 V
- More than 1 Million Erase/Write Cycles
- Data Retention >200 Years
- Factory Programming Available
- Automotive (E): -40°C to +125°C
- Available Packages for (24AA025E48) are : 8-lead SOIC and 6-lead SOT-23
- Pb-free and RoHS Compliant
- Temperature Ranges: Industrial (I): -40°C to +85°C
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23-6 (SOT-26)
Mounting Method:
Surface Mount