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Manufacturer Part #
24AA256UIDT-I/SN
24AA256 Series 256 Kb (32 K x 8) 5.5 V 400 kHz I2C Serial EEPROM - SOIC-8 REEL
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Reel Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip 24AA256UIDT-I/SN - Product Specification
Shipping Information:
ECCN:
PCN Information:
Microchip has released a new Datasheet for the 24AA256/24LC256/24FC256 256K I2C Serial EEPROM Data Sheet of devices.Notification Status: FinalDescription of Change: Added 5-Lead SOT-23 package. Updated MSOP, PDIP, SOIC and SOIJ package drawings.Impacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 28 Jul 2022
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Part Status:
Microchip 24AA256UIDT-I/SN - Technical Attributes
| Memory Density: | 256kb |
| Memory Organization: | 32K x 8 |
| Supply Voltage-Nom: | 1.7V to 5.5V |
| Clock Frequency-Max: | 400kHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Data Retention: | 200 yr |
| Interface Type: | I2C |
| Access Time-Max: | 900ns |
| Operating Temp Range: | -40°C to +85°C |
| No of Terminals: | 8 |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3300 per Reel
Package Style:
SOIC-8
Mounting Method:
Surface Mount