Free shipping over $100 USD. Conditions apply
Manufacturer Part #
24AA64FT-I/OT
64Kb I2C EEPROM 1.7-5.5V 5-lead SOT-23
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Reel | ||||||||||
| Date Code: | |||||||||||
Microchip 24AA64FT-I/OT - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.Estimated First Ship Date: 23 April 2025 (date code: 2517)Revision History:February 7, 2025: Issued initial notification.March 26, 2025: Issued final notification. Attached the Qualification Report. Provided Estimated First Ship Date on April 23, 2025.
PCN Status:Initial NotificationDescription of Change:Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.
***FPCN108989 UPDATE***Description of Change: Qualification of 8008MD as a new die attach material and CuPdAu as a new wire material for selected various products available in 5L SOT-23 package assembled at MTAI.Revision History: November 18, 2024: Issued initial notification.January 27, 2025: Issued final notification. Attached the Qualification Report. Provided Estimated firstship date to be on February 28, 2025.Reason for Change: To improve manufacturability by qualifying 8008MD as a new die attach materialand CuPdAu as a new wire material
Description of Change: Qualification of 8008MD as a new die attach material and CuPdAu as a new wire material for selected various products available in 5L SOT-23 package assembled at MTAI.Reason for Change: To improve manufacturability by qualifying 8008MD as a new die attach material and CuPdAu as a new wire material
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8008MD as a new die attach material for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8008MD as a new die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:August 20, 2024 (date code: 2434)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=EU&field16=en&field2=24AA64FT-I/OT&field4=Microchip&field18=https://p1emea.futureelectronics.com/p/semiconductors--memory--RAM--eeprom--i2c-interface-protocol/24aa64ft-i-ot-microchip-8081961
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=EU&field16=en&field2=24AA64FT-I/OT&field4=Microchip&field18=https://p1emea.futureelectronics.com/p/semiconductors--memory--RAM--eeprom--i2c-interface-protocol/24aa64ft-i-ot-microchip-8081961
Available Packaging
Package Qty:
3000 per Reel