
Manufacturer Part #
24LC64-I/ST
24LC64 Series 64 Kb I2C 2 Wire (8K X 8) 2.5 V Serial EEPROM SMT - TSSOP-8
Microchip 24LC64-I/ST - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.Estimated First Ship Date: 23 April 2025 (date code: 2517)Revision History:February 7, 2025: Issued initial notification.March 26, 2025: Issued final notification. Attached the Qualification Report. Provided Estimated First Ship Date on April 23, 2025.
Description of Change:Qualification of Au and CuPdAu as a new wire material, AMK-EP27 as a new die attach material and AMK-MC27 as a new mold compound material for selected 24AA32xx, 24AA64x, 24FC64x, 24LC32xx, 24LC64xx, AT24C32x and AT24C64x device families available in 8L TSSOP (4.4mm) package.Reason for Change:To improve manufacturability by qualifying Au and CuPdAu as a new wire material, AMK-EP27 as a new die attach material and AMK-MC27 as a new mold compound material.Change Implementation Status:In ProgressEstimated First Ship Date:31 March 2025 (date code: 2514)
PCN Status:Initial NotificationDescription of Change:Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.
PCN Status:Final NotificationDescription of Change:Qualification of Au and CuPdAu as a new wire material, AMK-EP27 as a new die attach material and AMK-MC27 as a new mold compound material for selected 24AA32xx, 24AA64x, 24FC64x, 24LC32xx, 24LC64xx, AT24C32x and AT24C64x device families available in 8L TSSOP (4.4mm) package.Reason for Change:To improve manufacturability by qualifying Au and CuPdAu as a new wire material, AMK-EP27 as a new die attach material and AMK-MC27 as a new mold compound material.
Revision History:April 9, 2022: Re-issued this PCN to update the affected CPN list by removing 24FC64F, 24LC64F, 24AA64F products.Notification Status: FinalDescription of Change:1) Added Product Identification System section for Automotive;2) Updated DFN, PDIP, SOIC, SOT-23, TDFN and TSSOP package drawings;3) Added DFN-S product offering;4) Replaced terminology Master and Slave with Host and Client, respectively;5) Replaced Automotive (E): designation with Extended (E): designation;6) Reformatted some sections for better readability.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 18 Mar 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.
Part Status:
Microchip 24LC64-I/ST - Technical Attributes
Memory Density: | 64kb |
Memory Organization: | 8 K x 8 |
Supply Voltage-Nom: | 2.5V to 5.5V |
Clock Frequency-Max: | 400kHz |
Write Cycle Time-Max (tWC): | 5ms |
Package Style: | TSSOP-8 |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
100 per Tube
Package Style:
TSSOP-8
Mounting Method:
Surface Mount