Manufacturer Part #
24LC64T-I/SM
24LC64 Series 64 Kb I2C 2 Wire (8K X 8) 2.5 V Serial EEPROM SMT - SOIJ-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: |
Product Variant Information section
Available PackagingPackage Qty:2100 per Reel Package Style:SOIJ-8 Mounting Method:Surface Mount |
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| Date Code: | 2607 | ||||||||||
Microchip 24LC64T-I/SM - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Product Category: MemoryDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 24AA1025, 24AA1026, 24AA128, 24AA256, 24AA32A, 24AA512, 24AA515, 24AA64, 24CS128, 24CS256, 24CS32, 24CS512, 24CS64, 24CSM01, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC1025, 24FC1026, 24FC128, 24FC256, 24FC512, 24FC515, 24FC64, 24LC1025, 24LC1026, 24LC128, 24LC256, 24LC32A, 24LC512, 24LC515, 24LC64, 25AA1024, 25LC1024, AT24C512C, AT24CM01 and AT25M01 device families available in 8L SOIC (.150in) and 8L SOIJ (.208in) packages at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material at MTAI assembly site.Estimated First Ship Date: 15 April 2026 (date code: 2616)
Description of Change: Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.Estimated First Ship Date: 23 April 2025 (date code: 2517)Revision History:February 7, 2025: Issued initial notification.March 26, 2025: Issued final notification. Attached the Qualification Report. Provided Estimated First Ship Date on April 23, 2025.
Description of Change:Qualification of QMI-519 die attach material at MTAI assembly site for 24LC32A/SM, 24LC32A-E/SM, 24AA32AT-I/SM, 24LC32AT/SM, 24AA64T-I/SM, 24LC64T-E/SM, 24AA32AT/SM, 24LC64T-I/SM, 24FC64-I/SM, 24FC64T-I/SM, 24LC64-I/SM, 24LC64-E/SM, 24AA64-I/SM, 24AA32A-I/SM, 24LC32A-I/SM, 24LC32AT-I/SM, 24LC32AT-E/SM, 24AA64T-E/SM and 24AA64-E/SM catalog part numbers (CPN) available in 8L SOIJ (.208in) package.Reason for Change:To improve manufacturability and on time delivery performance by qualifying QMI-519 die attach material at MTAI assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.
Part Status:
Microchip 24LC64T-I/SM - Technical Attributes
| Memory Density: | 64kb |
| Memory Organization: | 8 K x 8 |
| Supply Voltage-Nom: | 2.5V to 5.5V |
| Clock Frequency-Max: | 400kHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Package Style: | SOIJ-8 |
| Mounting Method: | Surface Mount |
Features & Applications
It has been developed for advanced, lowpower applications.
Features:
- Low-Power CMOS Technology:
- Activity current 1 mA, typical
- Standby current 1 µA, typical
- 2-Wire Serial Interface, I2C™ Compatible
- Schmitt Trigger inputs for noise suppression
- Output Slope Control to Eliminate Ground Bounce
- 100 kHz and 400 kHz Clock Compatibility
- 1 MHz clock for FC versions
- Page Write Time 5 ms,Max
- Self-Timed Erase/Write Cycle
- 32-Byte Page Write Buffer
- Hardware Write-Protect
- ESD Protection >4000 V
- More than 1 Million Erase/Write Cycles
- Data Retention > 200 years
Applications:
- Personal communications
- Data acquisition
Available Packaging
Package Qty:
2100 per Reel
Package Style:
SOIJ-8
Mounting Method:
Surface Mount