Shipping Country
Free shipping within the continental US over $50. Conditions apply
Select Country
Manufacturer Part #
AT24CM02-SSHM-B
Download the CAD models for this product. Learn more about SnapMagic.
100 per Tube
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Product Category: Crypto Authentication, Crypto Memory, MemoryDescription of Change: Implement new packing materials and packing changes for AT34C02D, AT24C08D, AT24HC02C, AT88SC0104CA, AT88SC1616C, AT88SC0404CA, AT24MAC602, ATSHA204A, ATECC608A, ATECC508A, AT93C66B, ATECC108A, ATECC608C, AT24C16C, AT88SC0808CA, AT25160B, AT25080B, 25CS160, 24LC64, AT24C01C, AT24C04C, AT24C128C, AT24C04D, 24AA16H, AT24C08C, 24AA02H, 24LC04B, 24LC16B, AT93C56B, 24AA04H, 24AA01H, 24LC04BH, 24LC02BH, 24LC01BH, 25AA640A, 25LC640A, AT93C46E, 25CS640, AT24CM01, AT24C256C, 24AA256, AT24C512C, 24AA512, 24LC512, AT24C02C, AT25320B, 24LC256, 24FC256, 24FC512, AT24CM02, AT24C64B, AT24HC04B, AT24MAC402, AT24C16D, 25CSM04, AT93C86A, AT93C46D, AT24C02D and AT24C64D device families available in 8L SOIC and TSSOP (3.90mm and 4.4mm) packages.Reason for Change: To improve manufacturability by implementing new packing materials and packing changes.Estimated First Ship Date: 17 July 2026 (date code: 2629)
Microchip has released a new Datasheet for the AT24CM02 - 2-Mbit I?C Serial EEPROM of devices.Description of Change:Replaced Atmel WLCSP drawing with Microchip version (no change to form, fit or function). Corrected embedded addressing bits in waveforms. Removed typical DC Characteristics parameters.Reason for Change: To improve productivity.
Revision History:May 04, 2023: Issued initial notification.January 10, 2024: Issued final notification. Attached the Qualification Report. Updated the LF material, Paddle size and Die Attach material of MTAI in the Pre and Post Change Summary. Provided estimated first ship date to be on January 26, 2024.January 30, 2024: Re-issued final notification to update Pre and Post Change Summary.Description of Change:Qualification of MTAI as an additional assembly site for selected AT24C512C-SSHxx, AT24CM01-SSHxx and AT24CM02-SSHxx device families available in 8L SOIC (3.90mm(.150in)) package.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve productivity by qualifying MTAI as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:January 26, 2024 (date code: 2404)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
Revision History:\May 04, 2023: Issued initial notification.January 10, 2024: Issued final notification. Attached the Qualification Report. Updated the LF material, Paddle size and Die Attach material of MTAI in the Pre and Post Change Summary. Provided estimated first ship date to be on January 26, 2024.Description of Change:Qualification of MTAI as an additional assembly site for selected AT24C512C-SSHxx, AT24CM01-SSHxx and AT24CM02-SSHxx device families available in 8L SOIC (3.90mm(.150in)) package.additional assembly site for selected AT24C512C-SSHxx, AT24CM01-SSHxx and AT24CM02-SSHxx device families available in 8L SOIC (3.90mm(.150in)) package.
Description of Change:Qualification of MTAI as an additional assembly site for selected AT24C512C-SSHxx, AT24CM01-SSHxx and AT24CM02-SSHxx device families available in 8L SOIC (3.90mm(.150in)) package.Reason for Change:To improve productivity by qualifying MTAI as an additional assembly site.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
