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Manufacturer Part #
25LC080CT-I/SN
25LC080C Series 8 kB (1 K x 8) 5.5 V SMT SPI Interface Protocol - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Reel Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip 25LC080CT-I/SN - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of 36.5K process technology for selected products of the 25AA080C, 25AA080D, 25AA160C, 25AA160D, 25LC080C, 25LC080D, 25LC160C, 25LC160D, AT25080Band AT25160B device families.Reason for Change: To improve manufacturability by qualifying additional process technology.
Description of Change: Qualification of 36.5K process technology for selected products of the 25AA080C, 25AA080D, 25AA160C, 25AA160D, 25LC080C, 25LC080D, 25LC160C, 25LC160D, AT25080B and AT25160B device families.Reason for Change: To improve manufacturability by qualifying additional process technology.
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Part Status:
Microchip 25LC080CT-I/SN - Technical Attributes
| Memory Density: | 8kb |
| Memory Organization: | 1 K x 8 |
| Supply Voltage-Nom: | 2.5V to 5.5V |
| Clock Frequency-Max: | 10MHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Word Length: | 8b |
| Data Retention: | 200 yr |
| Supply Current: | 5mA |
| Operating Temp Range: | -40°C to +85°C |
| Storage Temperature Range: | -65°C to +150°C |
| No of Terminals: | 8 |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3300 per Reel
Package Style:
SOIC-8
Mounting Method:
Surface Mount