Manufacturer Part #
25LC640AT-I/ST
25LC640A Series 64 Kb (8 K x 8) 5.5 V SMT SPI Bus Serial EEPROM - TSSOP-8
Microchip 25LC640AT-I/ST - Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 8L TSSOP (4.4mm) package assembled at MMT assembly site.Impacts to Data Sheet:NoneReason for Change:To improve on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Change Implementation Status:In ProgressEstimated First Ship Date:March 17, 2022 (date code: 2212)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 8L TSSOP (4.4mm) package assembled at MMT assembly site.Reason for Change:To improve on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.
PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of 36.5K process technology for selected products of the 25AA640A and 25LC640A device families. Impacts to Data Sheet: NoneChange Impact: None Reason for Change: To improve manufacturability by qualifying an additional fabrication site.Change Implementation Status: In ProgressEstimated First Ship Date:December 01, 2021 (date code: 2149)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Microchip 25LC640AT-I/ST - Technical Attributes
Memory Density: | 64kb |
Memory Organization: | 8 K x 8 |
Supply Voltage-Nom: | 2.5V to 5.5V |
Clock Frequency-Max: | 10MHz |
Write Cycle Time-Max (tWC): | 5ms |
Package Style: | TSSOP-8 |
Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
2500 per Reel
Package Style:
TSSOP-8
Mounting Method:
Surface Mount