Manufacturer Part #
IDT71V016SA Series 1 Mb (64 K x 16) 3.6 V CMOS Static RAM - TSOP II-44
|Standard Pkg:|| |
Product Variant Information section
135 per Tube
Renesas 71V016SA10PHG - Product Specification
Subject: Add Alternate Assembly Location and Change Material Sets on TSOP-44Revision Description:Initial ReleaseDescription of Change:Renesas is adding Greatek, Taiwan as an alternate assembly location for TSOP-44 package. Presently, Greatek is the qualified assembly location for Renesas. The current assembly location for the impacted package is at OSET, Taiwan. The material sets of the current and the alternate assembly location are as shown in the below table. There will be changes in the material sets at the alternate location.In addition, the material sets namely die attach and mold compound used at the current assembly OSET will be changed to new materials as shown in the below table as a result of OSET standardize the materials used on all TSOP-44 package.There will be no changes in moisture sensitive level resulted from the above mentioned two changes.Impact on Fit, Form, Function, Quality & Reliability: The change will have no impact on the form, fit, function, quality, reliability and environmental compliance of the products.
Description of Change:Renesas is converting shipping media from Tube to Tray on package TSOP-44. The current shipping media in Reel remains unchanged.An ustrial standard JEDEC shipping tray will be introduced. In addition, one of the Orderable Part# that is presently ship in Tray (Tray part# 124-4725-119) will convert to the new Tray (New Tray part# TR142050). The MOQ and FOI in Tray shipment shall change to 135 units. Refer Appendix A and Appendix B for more information.Reason for Change:To align the shipping media throughout the entire manufacturing process from Assembly to Shipping.
Renesas 71V016SA10PHG - Technical Attributes
|Memory Organization:||64 K x 16|
|Supply Voltage-Nom:||3.6V to 3.15V|
|Package Style:||TSOP II-44|
|Mounting Method:||Surface Mount|
135 per Tube