Manufacturer Part #
CY7C1021DV33 Series 1 Mb (64 K x 16) 3.3 V 10 ns Static RAM - TSOP-44
|Standard Pkg:|| |
Product Variant Information section
1000 per Reel
Qualification of Greatek Electronics Inc.as an Alternate Assembly Site for Select 44-Lead TSOP II Package Description of Change: Cypress announces the qualification of Greatek Electronics Inc., Taiwan located at No. 136, Gong-Yi Rd., Zhunan Township, Miaoli County 350, Taiwan, as an alternate assembly site for select Memory products offered in 44-Lead TSOP II package.
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
Description of Change: Cypress has qualified an EIA standard outline cover tape for all tape and reel shipment at Cypress Philippines (CML, Gateway Business Park, SEPZA, Brgy., Javalera, General Trias, Cavite, Philippines). The new cover tape meets the Cypress specification and demonstrates the same quality as the current cover tape.
The purpose of this addendum is to remove the non-BGA marketing part numbers from the Affected Parts List that are not included in this change.Description of Change: The purpose of this addendum is to remove the non-BGA marketing part numbers from the Affected Parts List that are not included in this change. Cypress announced the addition of a serial number, called "unit code", to the top mark of BGA products at Cypress Bangkok. This unit code will be implemented on products in the BGA package families. The unit code will enhance the traceability to specific Assembly equipment used for any single unit. The attached file includes pictures that show the unit code top mark location for the various package sizes affected by this change.
|Memory Organization:||64 K x 16|
|Supply Voltage-Nom:||3V to 3.6V|
|Package Style:||TSOP II-44|
|Mounting Method:||Surface Mount|
Features & Applications
The input/output pins (I/O0 through I/O15) are placed in a high-impedance state when the device is deselected [CE(bar) HIGH], the outputs are disabled [OE(bar) HIGH], the BHE(bar) and BLE(bar) are disabled [BHE(bar), BLE(bar) HIGH], or during a Write operation [CE(bar) LOW, and WE(bar) LOW]. The CY7C1021DV33 is available in Pb-free 44-pin 400-Mil wide Molded SOJ, 44-pin TSOP II and 48-ball VFBGA packages.
- Temperature ranges
- Industrial: –40 °C to 85 °C
- Automotive-A: –40 °C to 85 °C
- Pin-and function-compatible with CY7C1021CV33
- High speed
- tAA = 10 ns
- Low active power
- ICC = 60 mA @ 10 ns
- Low CMOS standby power
- ISB2 = 3 mA
- 2.0 V data retention
- Automatic power-down when deselected
- CMOS for optimum speed/power
- Independent control of upper and lower bits
- Available in Pb-free 44-pin 400-Mil wide molded SOJ, 44-pin TSOP II and 48-ball VFBGA packages
1000 per Reel