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Manufacturer Part #
SST39SF010A-55-4I-NHE
4.5V TO 5.5V 1MBIT MULTI-PURPOSE FLASH
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:30 per Tube Package Style:PLCC-32 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip SST39SF010A-55-4I-NHE - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of MTAI as an additional final test site for selected SST39SF040, SST39SF020A and SST39SF010A device families available in 32L PLCC (11.5x14x3.37mm) package.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying MTAI as an additional final test site.
PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of MTAI as an additional Scan/Pack process site and implement packing changes for selected products available in 32L PLCC (11.5x14x3.37mm) package.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change: To improve on-time delivery performance by qualifying MTAI as an additional Scan/Pack process site.Change Implementation Status: In ProgressEstimated First Ship Date: February 03, 2022 (date code: 2206)See attached PCN for full details
Description of Change: Implement MMT shipping tube for selected AT27xxxx, AT28xxxx and SST39xxxx products available in 32L PLCC package.Pre Change:LPI shipping tubePost Change:MMT shipping tubeReason for Change:To improve on-time delivery performance by implementing MMT shipping tube Estimated First Ship Date:December 26, 2020 (date code: 2052)
PCN Status: Final notification. PCN Type: Manufacturing ChangeDescription of Change: Implement MMT shipping tube for selected AT27xxxx, AT28xxxx and SST39xxxx products available in 32L PLCC package.Pre Change: LPI shipping tube Post Change:MMT shipping tube Impacts to Data Sheet: None Change Impact:None Reason for Change:To improve on-time delivery performance by implementing MMT shipping tubeChange Implementation Status:In Progress Estimated First Ship Date:December 26, 2020 (date code: 2052)
Revision History:April 21, 2020: Issued initial notification.September 18, 2020: Issued final notification.October 20, 2020: Re-issued the final notification to include the Qualification Report. Corrected pre and post change to correct the word bond wire to die attach material.Description of Change: Qualification of MMT as a new assembly site for selected SST39xxx products available in 32L PLCC (11.5x14x3.37mm) package.Pre Change:Assembled at LPI or GTK assembly site using 8340 die attach and C151 lead frame material.Post Change:Assembled at MMT using 3280 die attach and A194 lead frame material.Pre and Post Change Summary: See attachedImpacts to Data Sheet: NoneChange Impact:NoneReason for Change:Due to unforeseen business conditions, MMT has been qualified as a new assembly effective immediately.Change Implementation Status:In ProgressEstimated First Ship Date:September 20, 2020 (date code: 2039)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts
Final Notice: Qualification of MMT as a new assembly site for selected SST39xxx products available in 32L PLCC (11.5x14x3.37mm) package.Description of Change: Qualification of MMT as a new assembly site for selected SST39xxx products available in 32L PLCC (11.5x14x3.37mm) package.Due to unforeseen circumstances, that are out of Microchip�s control, full qualification will be made available at a date after shipment as Microchip plans to continue fulfill orders by shipping from the new assembly site as soon as possible as to not disrupt customer orders.Pre Change: Assembled at LPI or GTK assembly site using 8340 bond wire material and C151 lead frame material.Post Change:Assembled at MMT using 3280 bond wire material and A194 lead frame material.
CCB 4218 Initial Notice: Qualification of MMT as a new assembly site for selected SST39xxx products available in 32L PLCC (11.5x14x3.37mm) package.Description of Change:Qualification of MMT as a new assembly site for selected SST39xxx products available in 32L PLCC (11.5x14x3.37mm) package.Pre Change:Assembled at LPI or GTK assembly site using 8340 bond wire material and C151 lead frame material.Post Change:Assembled at MMT using 3280 bond wire material and A194 lead frame material.Reason for Change:To improve manufacturability by qualifying MMT as a new assembly site. Estimated Qualification Completion Date:June 2020
Part Status:
Microchip SST39SF010A-55-4I-NHE - Technical Attributes
| Memory Density: | 1Mb |
| Memory Organization: | 128 K x 8 |
| Supply Voltage-Nom: | 4.5V to 5.5V |
| Access Time-Max: | 55ns |
| Package Style: | PLCC-32 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
30 per Tube
Package Style:
PLCC-32
Mounting Method:
Surface Mount