Manufacturer Part #
SST39VF Series 2 Mbit 128 K x 16 3 V Multi-Purpose Flash - TSOP-48
|Standard Pkg:|| |
Product Variant Information section
96 per Tray
Revision History:February 23, 2021: Issued initial notification.April 14, 2021: Re-issued initial notification to change die attach material to AP-4300 in pre and post change and qual plan.Description of Change:Qualification of SIGN as a new assembly site for selected SST39LFxx and SST39VFxx device families available in 48L TSOP (12x20mm) package.Reason for Change:To improve on-time delivery performance by qualifying SIGN as a new assembly site.Estimated Qualification Completion Date: August 2021
Description of Change:Qualification of SIGN as a new assembly site for selected SST39LFxx and SST39VFxx device families available in 48L TSOP (12x20mm) package.Pre Change:Assembled at LPI using lead frame with paddle size 207x142mils, 183x161mils or 160x130mils.Post Change:Assembled at SIGN using lead frame with paddle size 209x165mils or 159x165milsReason for Change:To improve on-time delivery performance by qualifying SIGN as a new assembly site.Estimated Qualification Completion Date:August 2021
|Memory Organization:||128 K x 16|
|Supply Voltage-Nom:||2.7V to 3.6V|
|Mounting Method:||Surface Mount|
Features & Applications
NOTE: This SST product is migrating to the preferred Microchip (MCP) part number. All products bearing the Microchip part number are identical in form, fit and function to the products with the legacy SST prefix/logo mark.
The SST39VF200A-70-4C-EKE is a part of SST39VF Series Multi-Purpose Flash Plus. It has an standard operating temperature ranging from -40°C to +85°C, it comes in TSOP-48 package.
The SST39VF200A is a 128K x16 CMOS Multi-Purpose Flash (MPF) manufactured with SST proprietary, high performance CMOS SuperFlash technology. The split-gate cell design and thick oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches.
- Organized as 128K x16
- Low Power Consumption:
- Active Current: 9 mA (typical)
- Standby Current: 3 μA (typical)
- Sector-Erase Capability:Uniform 2 KWord sectors
- Block-Erase Capability:Uniform 32 KWord blocks
- Fast Erase and Word-Program: Sector-Erase Time:18 ms (typical), Block-Erase Time:18 ms (typical), Chip-Erase Time:70 ms (typical, Word-Program Time:14 μs (typical)
- Packages Available:48-lead TSOP (12mm x 20mm), 48-ball TFBGA (6mm x 8mm), 48-ball WFBGA (4mm x 6mm)
- All non-Pb (lead-free) devices are RoHS compliant
96 per Tray