Manufacturer Part #
8 Mbit SPI Serial Flash, 2.3V, C TEMP, PDIP
|Standard Pkg:|| |
Product Variant Information section
60 per Tube
Description of Change: Qualification of MMT as an additional assembly site for SST25VF080B-50-4C-PAE catalog part number (CPN) available in 8L PDIP package.Pre Change:Assembled at GTK using 8340 die attach and G600 molding compound material.Post Change:Assembled at GTK using 8340 die attach and G600 molding compound material or assembled at MTAI using CRM-1064L die attach and GE800 molding compound material.Pre and Post Change Summary:see attachedImpacts to Data Sheet: NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:February 27, 2021 (date code: 2109)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary:see attachedRevision History:January 27, 2021: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on February 27, 2021.
Description of Change:Qualification of Semiconductor Manufacturing International Corporation (SMIC) as an additional fabrication site for selected SST25PF020B, SST25VF020B, SST25VF040B and SST25VF080B device families.Pre Change:Device families SST25PF020B and SST25VF020B fabricated at Maxchip Electronics Corporation -Fab 8A (M08A) using 8-inch wafersDevice families SST25VF040B and SST25VF080B fabricated at Grace SemiconductorManufacturing Company-Fab1 (GC01) using 8-inch wafersPost Change:Device families SST25PF020B and SST25VF020B fabricated at Maxchip Electronics Corporation -Fab 8A (M08A) using 8-inch wafers or Fabricated at Semiconductor Manufacturing International Corporation SMIC - (SCB1) using 12-inch wafersDevice families SST25VF040B and SST25VF080B fabricated at Grace Semiconductor Manufacturing Company-Fab1 (GC01) using 8-inch wafers or Fabricated at Semiconductor Manufacturing International Corporation SMIC - (SCB1) using 12-inch wafers.Reason for Change:To improve manufacturability by qualifying Semiconductor Manufacturing International Corporation as an additional fabrication site.Estimated First Ship Date:June 08, 2020 (date code: 2024)
Microchip has released a new Product Documents for the SST25VF080B Data Sheet - 8-Mbit SPI Serial Flash of devices.Description of Change: 1) Updated standby current. 2) Updated formatting to current template. 3) Updated package drawings to latest versions. 4) Added package marking section. 5) Updated Product Identification System Nickel plating note.6) Added 16-ball XFBGA package.Reason for Change: To Improve ProductivityDate Document Changes Effective: 31 Mar 2020NOTE: Please be advised that this is a change to the document only the product has not been changed.
|Memory Organization:||1 M x 8|
|Supply Voltage-Nom:||2.7V to 3.6V|
|Mounting Method:||Through Hole|
60 per Tube