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Manufacturer Part #
SST26VF016B-104I/SM
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90 per Tube
SOIJ-8
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for selected SST25PF020B, SST25VF020B, SST25VF040B, SST25VF080B, SST26VF016B, SST26VF016BEUI, SST26VF020A, SST26VF032B, SST26VF032BA, SST26VF032BEUI, SST26VF040A, SST26VF064B, SST26VF064BA, SST26VF064BEUI, SST26VF080A and USBF8100 device families available in 8L SOIJ (.208in) package at MTAI assembly site.Reason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material. Estimated First Ship Date: 12 June 2026 (date code: 2624)
*** Update of FPCN 119261 ***Revision History:February 23, 2026: Issued initial notification.February 26, 2026: Re-issued initial notification to include SOIJ package in the Notification subject.Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for selected SST26VF016B, SST26VF016BEUI, SST26VF032B, SST26VF032BA, SST26VF032BEUI, SST25VF080B, SST25VF040B, SST26WF064C, SST26VF064B, SST26VF064BA, SST26VF064BEUI, SST25VF020B, SST25PF020B, SST26VF080A, SST26VF040A, SST26VF020A, USBF8100, SST26WF080B, SST26WF080BA, SST26WF040B, SST26WF040BA, SST26WF016B and SST26WF016BA device families available in 8L SOIC and SOIJ (.208in and .150in) packages at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material.Estimated Qualification Completion Date: April 2026
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for selected SST26VF016B, SST26VF016BEUI, SST26VF032B, SST26VF032BA, SST26VF032BEUI, SST25VF080B, SST25VF040B, SST26WF064C, SST26VF064B, SST26VF064BA, SST26VF064BEUI, SST25VF020B, SST25PF020B, SST26VF080A, SST26VF040A, SST26VF020A, USBF8100, SST26WF080B, SST26WF080BA, SST26WF040B, SST26WF040BA, SST26WF016B and SST26WF016BA device families available in 8L SOIC (.208in and .150in) packages at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach materialEstimated Qualification Completion Date: April 2026
Data Sheet - SST26VF016B-3.0V 16 Mbit Serial Quad I/O (SQI) Flash Memory Data Sheet Document Revision Description of Change: 1) Removed the SST26VF016BA device from the data sheet. 2) Added Part MarkingsNOTE: Please be advised that this is a change to the document only the product has not been changed.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
