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DSPIC33CDVL64MC106-E/M8
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40 per Tube
VGQFN-64
Surface Mount
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*** Update of FPCN 109558 & 119298 ***Revision History: December 10, 2024: Issued initial notification.February 19, 2026: Issued final notification. Provided estimated first ship date to be on February 27, 2026. Added column "Change (Yes/No)" in the pre and post change table. Updated parts list to include (See attached SPCN document for more details June 22, 2026: Re-issued final notification to attach the Qualification Report. Update the timetable summary for Qual Report availability.Description of Change: Qualification of CVB715BUA as a new mold compound material for selected dsPIC33CDVC256MP506 and dsPIC33CDVC128MP506 device families available in 64L VGQFN (9x9x0.927) package.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying CVB715BUA as a new molding compound material.Change Implementation Status: In ProgressEstimated First Ship Date: 10 June 2026 (date code: 2624)
*** Update of DPCN 109558 ***February 19, 2026: Issued final notification. Provided estimated first ship date to be on February 27, 2026. Added column "Change (Yes/No)" in the pre and post change table. Description of Change: Qualification of CVB715BUA as a new mold compound material for selected dsPIC33CDVC256MP506and dsPIC33CDVC128MP506 device families available in 64L VGQFN (9x9x0.927) package.Reason for Change: To improve manufacturability by qualifying CVB715BUA as a new molding compound material.Estimated Qualification Completion Date: 31 March 2026Estimated First Ship Date: 27 February 2026 (date code: 2609)
Microchip has released a new Document for the dsPIC33CDVL64MC106 Family Silicon Errata and Data Sheet Clarification of devices. Description of Change:Added data sheet clarification 1 (MOSFET Gate Driver). Reason for Change: To improve productivity.
Description of Change:Added silicon revision D3.Added silicon issue 10 (MOSFET Gate Driver).Reason for change: To Improve Productivity
Microchip has released a new Datasheet for the dsPIC33CDVL64MC106 Family Data Sheet of devices. Notification Status: FinalDescription of Change:Revision E (June 2025)• Sections:- Updated Section “Host dsPIC DSC Features”,Section “Functional Safety Readiness– ISO 26262 / IEC 61508 / IEC 60730”,Section “Referenced Sources”,Section 2.1 “Basic Connection Requirements”,Section 12.2 “CommunicationsPort (DE2 Interconnect)”, Section 12.3“Low-Side PWM Inputs (PWMAL, PWMBL,PWMCL)”, Section 12.4 “High-Side PWMInputs (PWMAH, PWMBH, PWMCH)”,Section 12.5 “Output Enable (OE) Input”,Section 12.7 “Wake Input (WAKE)”,Section 12.19.3 “Sleep Mode”,Section 12.23.1 “Communications Interface”,Section 33.0 “Electrical Characteristics”and Section 35.0 “MOSFET GateDriver Electrical Characteristics”.- Removed Section 2.6 “MOSFET GateDriver Sleep Mode Requirements”.• Tables:- Updated Table 2, Table 3, Table 1-2,Table 8-2, Table 33-17, Table 33-5,Table 33-34 and Table 35-1.- Added Table 12-1.• Figures:- Updated Figure (Pin Diagrams), Figure 12-1,Figure 12-2 and Figure 13-2.- Removed Figure 2-3 “Wake Extender” andFigure 12-5 “Wake Extender ExampleSoftware Flow”.• Registers:- Updated Register 11-12, Register 13-5,Register 13-18, Register 13-19,Register 13-26, Register 14-2, Register 14-3,Register 14-5, Register 22-2 andRegister 30-6.- Added Register 29-1.• Examples:- Updated Example 12-1.Impacts to Data Sheet: See above details.Reason for Change: To Improve Productivity.Change Implementation Status: CompleteDate Document Changes Effective: 25 Jun 2025
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
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On Order
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