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Manufacturer Part #
DSPIC33EP256GP502-I/SO
dsPIC33EP Series 32 kB RAM 256 kB Flash 16-Bit Digital Signal Controller-SOIC-28
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:27 per Tube Package Style:SOIC-28 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip DSPIC33EP256GP502-I/SO - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fabrication site for selected dsPIC33EP128xx, dsPIC33EP256xx, dsPIC33EP32xx, dsPIC33EP512xx, DSPIC33EP64xx, PIC24EP128GP2xx, PIC24EP128MC2xx, PIC24EP256GP2xx, PIC24EP256MC2xx, PIC24EP32GP2xx, PIC24EP32MC2xx, PIC24EP512GP2xx, PIC24EP512MC2xx, PIC24EP64GP2xx and PIC24EP64MC2xx device families available in various packages.Reason for Change:To improve on-time delivery performance by qualifying Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fab assembly site.
Revision History:March 9, 2023: Issued initial notification.January 29, 2024: Issued final notification. Updated the affected parts list. Updated notification subject, description of change, and qual title accordingly. Provided estimated first ship date to be on January 31, 2024.February 8, 2024: Re-issued final notification. Updated PCN title from initial notice to final notice. Description of Change:Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fabrication site for selected DSPIC33EPxxxGPxxx, DSPIC33EPxxxMCxxx, PIC24EPxxxGPxxx, and PIC24EPxxxMCxxx device families available in various packages.Reason for Change:To improve on-time delivery performance by qualifying Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fab assembly site.
Revision History:March 9, 2023: Issued initial notification.January 29, 2024: Issued final notification. Updated the affected parts list. Updated notification subject, description of change, and qual title accordingly. Provided estimated first ship date to be on January 31, 2024.Description of Change:Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fabrication site for selected DSPIC33EPxxxGPxxx, DSPIC33EPxxxMCxxx, PIC24EPxxxGPxxx, and PIC24EPxxxMCxxx device families available in various packages.Pre and Post Change Summary: See attachedmpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve on-time delivery performance by qualifying Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fab assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:January 31, 2024 (date code: 2405)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Due to unforeseen circumstances, that are out of Microchip?s control, full qualification will be made available as soon as it is approved which may be after the estimated first ship date so that Microchip can maintain continuity of supply and not disrupt customer orders.Time Table Summary: see attached
Microchip has released a new Errata for the dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X, and PIC24EPXXXGP/MC20X Family Silicon Errata and Data Sheet Clarification of devices. If you are using one of these devices please read the document located at dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X, and PIC24EPXXXGP/MC20X Family Silicon Errata and Data Sheet Clarification.Notification Status: FinalDescription of Change: Updated silicon issue 30.Impacts to Data Sheet: NoneReason for Change: To Improve Productivity.Change Implementation Status: CompleteDate Document Changes Effective: 25 May 2023NOTE: Please be advised that this is a change to the document only the product has not been changed.
Description of Change:Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fabrication site for HA4583T-I/PT, HA4584T-I/PT catalog part numbers (CPN) and selected HA7619xxx, DSPIC33EPxxxGPxxx, DSPIC33EPxxxMCxxx, PIC24EPxxxGPxxx, and PIC24EPxxxMCxxx device families available in various packages.Reason for Change:To improve on-time delivery performance by qualifying Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fab assembly site.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=DSPIC33EP256GP502-I/SO&field4=Microchip&field18=https://p1na.futureelectronics.com/en/p/semiconductors--microcontrollers--16-bit-digital-signal-controller-dsc/dspic33ep256gp502-i-so-microchip-3183834
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- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=DSPIC33EP256GP502-I/SO&field4=Microchip&field18=https://p1na.futureelectronics.com/en/p/semiconductors--microcontrollers--16-bit-digital-signal-controller-dsc/dspic33ep256gp502-i-so-microchip-3183834
Microchip DSPIC33EP256GP502-I/SO - Technical Attributes
| Family Name: | dsPIC33EP |
| Core Processor: | dsPIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 256kB |
| RAM Size: | 32kB |
| Speed: | 70MHz |
| No of I/O Lines: | 21 |
| InterfaceType / Connectivity: | CAN/IrDA/I2C/LIN/SPI/UART |
| Peripherals: | DMA/POR/PWM/Watchdog |
| Number Of Timers: | 5 |
| Supply Voltage: | 3V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 6-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | SOIC-28 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
27 per Tube
Package Style:
SOIC-28
Mounting Method:
Surface Mount