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Manufacturer Part #
DSPIC33EP32GS506-I/PT
dsPIC33EP Series 4 kB RAM 32 kB Flash 16-Bit Digital Signal Controller -TQFP-64
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:160 per Tray Package Style:TQFP-64 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip DSPIC33EP32GS506-I/PT - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
SYST-11NNYZ564Microchip has released a new Document for the dsPIC33EPXXGS50X Family Silicon Errata and Data Sheet Clarification of devices. If you are using one of these devices please read the document located at dsPIC33EPXXGS50X Family Silicon Errata and Data Sheet Clarification.Notification Status: FinalDescription of Change:Adds data sheet clarification 8 (Electrical Characteristics).Impacts to Data Sheet: NoneReason for Change: To improve productivity.
Part Status:
Microchip DSPIC33EP32GS506-I/PT - Technical Attributes
| Family Name: | dsPIC33EP |
| Core Processor: | dsPIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 32kB |
| RAM Size: | 4kB |
| Speed: | 70MHz |
| No of I/O Lines: | 53 |
| InterfaceType / Connectivity: | IrDA/I2C/LIN/SPI/UART/USART |
| Peripherals: | Brown-out Detect/POR/PWM/Reset/Watchdog |
| Supply Voltage: | 3V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 22-chx12-bit |
| On-Chip DAC: | 2-chx12-bit |
| Watchdog Timers: | 1 |
| Package Style: | TQFP-64 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
160 per Tray
Package Style:
TQFP-64
Mounting Method:
Surface Mount