
Manufacturer Part #
DSPIC33EP64MC204-I/MV
33EP Microcontroller IC 16-Bit 70 MIPs 64KB (22K x 24) FLASH 48-UQFN (6x6)
Microchip DSPIC33EP64MC204-I/MV - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fabrication site for selected dsPIC33EP128xx, dsPIC33EP256xx, dsPIC33EP32xx, dsPIC33EP512xx, DSPIC33EP64xx, PIC24EP128GP2xx, PIC24EP128MC2xx, PIC24EP256GP2xx, PIC24EP256MC2xx, PIC24EP32GP2xx, PIC24EP32MC2xx, PIC24EP512GP2xx, PIC24EP512MC2xx, PIC24EP64GP2xx and PIC24EP64MC2xx device families available in various packages.Reason for Change:To improve on-time delivery performance by qualifying Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fab assembly site.
PCN Status:Final NotificationDescription of Change:Qualification of C194 as an additional lead frame material for selected DSPIC33EPxxxxx, PIC24EP12xxxx, PIC24EP25xxxx, PIC24EP32xxx and PIC24EP64xxx device families available in 48L UQFN (6x6x0.5mm) package.Reason for Change:To improve productivity by qualifying C194 as an additional lead frame material.
Microchip has released a new Errata for the dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X, and PIC24EPXXXGP/MC20X Family Silicon Errata and Data Sheet Clarification of devices. If you are using one of these devices please read the document located at dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X, and PIC24EPXXXGP/MC20X Family Silicon Errata and Data Sheet Clarification.Notification Status: FinalDescription of Change: Updated silicon issue 30.Impacts to Data Sheet: NoneReason for Change: To Improve Productivity.Change Implementation Status: CompleteDate Document Changes Effective: 25 May 2023NOTE: Please be advised that this is a change to the document only the product has not been changed.
Description of Change:Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fabrication site for HA4583T-I/PT, HA4584T-I/PT catalog part numbers (CPN) and selected HA7619xxx, DSPIC33EPxxxGPxxx, DSPIC33EPxxxMCxxx, PIC24EPxxxGPxxx, and PIC24EPxxxMCxxx device families available in various packages.Reason for Change:To improve on-time delivery performance by qualifying Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fab assembly site.
Description of Change:Qualification of C194 as an additional lead frame material for selected DSPIC33EPxxxxxxx, PIC24EP12xxxxxx, PIC24EP25xxxxxx, PIC24EP32xxxxx and PIC24EP64xxxxx device families available in 48L UQFN (6x6x0.5mm) package.Reason for Change:To improve productivity by qualifying C194 as an additional lead frame material.
CCB 1475 Initial Notice: Qualification of C194 lead-frame for selected QFN and UQFN packages at NSEB assembly site.Description of Change: Qualification of C194 lead-frame for 16L QFN (4x4x0.9mm), 16L QFN (3x3x0.9mm), 20L QFN (4x4x0.9mm), 28L QFN (6x6x0.9mm), 64L QFN (9x9x0.9mm), 28L UQFN (4x4x0.5mm) and 48L UQFN (6x6x0.5mm) packages at NSEB.Pre Change: EFTEC-64T lead framePost Change: EFTEC-64T or C194 lead frameNOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Available Packaging
Package Qty:
61 per Tube