Manufacturer Part #
DSPIC33FJ64MC202T-I/MM
dsPIC33F Series 8 kB RAM 64 kB Flash 16-Bit Digital Signal Controller - QFN-28
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1600 per Reel Package Style:QFN-28 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 1949 | ||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:July 13, 2017: Issued initial notification.August 02, 2018: Issued final notification. Attached the Qualification Report. Provided estimated first ship date on September 02, 2018.Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 0.25um TSMC wafer technology available in 28L QFN-S package at NSEB assembly site.Pre Change: Using gold (Au) bond wire, 8200T or 8600 die attach and G770HCD or G700LTD mold compound material.Post Change: Using palladium coated copper with gold flash (CuPdAu) bond wire, 8600 die attach and G700LTD mold compound material.Reason for Change:To improve manufacturability by qualifying CuPdAu bond wire at NSEB assembly site.Estimated First Ship Date:September 02, 2018 (date code: 1836)
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um TSMC wafer technology available in 28L QFN-S, 64L, 44L and 28L QFN packages.Pre Change: Assembled at MTAI assembly site using gold (Au) wire.Post Change: Assembled at MTAI assembly site using gold (Au) wire and MMT assembly site using palladium coated copper wire with gold flash (CuPdAu).Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site using palladium coated copper wire with gold flash (CuPdAu).Estimated First Ship Date:July 25, 2018(date code: 1830)
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um TSMC, 70nm SMIC, Vanguard,120K,130K, 150K, 160K, 165K, 200K and 290K wafer technologies in 44L, 28 QFN-S, 20L,16L and 28L QFN packages.Pre Change:Assembled at MTAI assembly site.Post Change:Assembled at MTAI or MMT assembly site.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site Estimated First Ship Date:June 24, 2018 (date code:1826)
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um TSMC, 70nm, SMIC, Vanguard,120K,130K, 150K, 160K, 165K, 200K and 290K wafer technologies available in 44L, 28L QFN-S, 20L,16L and 28L QFN packages..Pre Change: Assembled at MTAI assembly sitePost Change: Assembled at MTAI or MMT assembly siteReason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Estimated Qualification Completion Date:April 2018
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um TSMC, 70nm, SMIC, Vanguard,120K,130K, 150K, 160K, 165K, 200K and 290K wafer technologies available in 44L, 28L QFN-S, 20L,16L and 28L QFN packages.Pre Change: Assembled at MTAI assembly sitePost Change: Assembled at MTAI or MMT assembly siteReason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um TSMC wafer technology available in 64L,28L QFN-S, 44L and 28L packages.Pre Change: Assembled at MTAI assembly site using gold (Au) wire.Post Change: Assembled at MTAI assembly site using gold (Au) wire and MMT assembly site using palladium coated copper wire with gold flash (CuPdAu). Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site using palladium coated copper wire with gold flash (CuPdAu).Estimated Qualification Completion Date: April 2018
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 0.25um TSMC wafer technology available in 28L QFN-S package at NSEB assembly sitePre Change: Using gold (Au) bond wire, 8200T or 8600 die attach and G770HCD or G700LTD mold compound material.Post Change:Using palladium coated copper with gold flash (CuPdAu) bond wire, 8600 die attach and G700LTD mold compound material.
Product Lifecycle:
-
ROHS Compliant -
Lead Free
Technical Attributes
| Family Name: | dsPIC33F |
| Core Processor: | dsPIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 64kB |
| RAM Size: | 8kB |
| Speed: | 40MHz |
| No of I/O Lines: | 21 |
| InterfaceType / Connectivity: | I2C/SPI/UART |
| Peripherals: | DMA |
| Number Of Timers: | 5 |
| Supply Voltage: | 3V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 6-chx10-bit / 6-chx12-bit |
| Watchdog Timers: | 1 |
| Package Style: | QFN-28 |
| Mounting Method: | Surface Mount |
Features & Applications
The DSPIC33FJ64MC202T-I/MM is a 16-Bit High-Performance Digital Signal Controller with Motor Control PWM having 30 Kbyte of RAM and 256 Kbyte of Program memory. Available in QFN-28 Package.
Features:
- High-Performance DSC CPU:
- Modified Harvard architecture
- C compiler optimized instruction set
- 16-bit wide data path
- 24-bit wide instructions
- Linear program memory addressing up to 4M instruction words
- Linear data memory addressing up to 64 Kbytes
- 83 base instructions: mostly 1 word/1 cycle
- Two 40-bit accumulators with rounding and saturation options
- Flexible and powerful addressing modes:
- Indirect
- Modulo
- Bit-Reversed
- Software stack
- 16 x 16 fractional/integer multiply operations
- 32/16 and 16/16 divide operations
- Operating Range:
- Up to 40 MIPS operation (at 3.0-3.6V):
- Industrial temperature range (-40°C to +85°C)
- Extended temperature range (-40°C to +125°C)
Available Packaging
Package Qty:
1600 per Reel
Package Style:
QFN-28
Mounting Method:
Surface Mount
Related Searches
See All Microchip
32,780 Parts
