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Manufacturer Part #
AT32UC3A1128-AUR
AT32 Series 128 kB Flash 32 kB SRAM 66 MHz 32-Bit Microcontroller - TQFP-100
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1000 per Reel Package Style:TQFP-100 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip AT32UC3A1128-AUR - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of palladium-coated copper with gold flash (CuPdAu) as a new wire material for ATSAM4LS2CA, ATSAM4LC8CA, ATSAM4LS8CA, AT32UC3A1512, AT32UC3A1128, AT32UC3A1256, ATSAM4LC4CA, ATSAM4LS4CA, ATSAM4LC2CA, AT32UC3C1128C, AT32UC3C1256C, AT32UC3C1512C and AT32UC3C164C device families available in 100L TQFP (14x14x1mm) package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying CuPdAu as a new wire material.
Description of Change: Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).Revision History:August 9, 2024: Issued initial notification.November 20, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 23, 2024.January 8, 2025: Re-issued to correct the pre and post table note from "66L" to "64L". Removed EOL CPNs PIC32MZ1024ECM100T-I/PF and PIC32MZ1024ECM100-I/PF from affected CPN list.
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
***FPCN104919 Update ***Revision History:April 16, 2024: Issued final notification.May 08, 2024: Re-issued final notification. Updated pre and post change summary table to include package type and package width.Description of Change:Implement new carrier tape leader and trailer length for various packages shipped from MPHL site.Reason for Change:To improve manufacturability by standardizing the carrier tape and trailer length for various packages shipped from MPHL site.
Revision History:September 7, 2023: Issued initial notification.October 18, 2023: Issued cancellation notification.PCN Status:Cancellation Notification Description of Change:This qualification was originally performed to qualify of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected AT32UC3xx and ATSAM4Lxx device families available in 100L TQFP (14x14x1mm) package.Impacts to Data Sheet:Not applicableChange Impact:Not applicableReason for ChangeMicrochip has decided to not qualify palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected AT32UC3xx and ATSAM4Lxx device families available in 100L TQFP (14x14x1mm) package.Change Implementation Status:Not applicableEstimated Qualification Completion Date:Not applicable
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected AT32UC3xx and ATSAM4Lxx device families available in 100L TQFP(14x14x1mm) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.
Part Status:
Microchip AT32UC3A1128-AUR - Technical Attributes
| Family Name: | AT32 |
| Core Processor: | AVR |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 128kB |
| RAM Size: | 32kB |
| Speed: | 66MHz |
| No of I/O Lines: | 69 |
| InterfaceType / Connectivity: | Ethernet/I2C/SPI/SSC/UART/USART/USB OTG |
| Peripherals: | Brown-out Detect/POR/PWM/Reset/Watchdog |
| Number Of Timers: | 3 |
| Supply Voltage: | 1.65V to 1.95V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 8-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | TQFP-100 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
1000 per Reel
Package Style:
TQFP-100
Mounting Method:
Surface Mount