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Manufacturer Part #
ATSAMC20E18A-ANT
SAMC20 Series 256 kB Flash 32 kB RAM 48 MHz 32-Bit Microcontroller - TQFP-32EP
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:2000 per Reel Package Style:TQFP-32 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip ATSAMC20E18A-ANT - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN114582 UPDATE/MATERIAL CHANGE*****Description of Change: Qualification of palladium-coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATSAMC20E1xx, ATSAMC21E1xx, ATSAMD20E1xx, ATSAMD21E1xx, ATSAMDA1E1xx, ATSAML10E1xx, ATSAML11E1xx, ATSAML21E1xx, PIC32CM1216JH01032, PIC32CM1216MC00032, PIC32CM1602GV00032, PIC32CM2532JH00032, PIC32CM2532JH01032, PIC32CM3204GV00032, PIC32CM3204JH00032, PIC32CM6408JH00032 and PIC32CM6408MC00032 device families available in 32L TQFP (7x7x1mm) package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium-coated copper with gold flash (CuPdAu) bond wire as an additional wire material.Estimated First Ship Date: 13 October 2025 (date code: 2542)*Revision History: August 27, 2025: Issued final notification. The new die attach material was qualified via PCN #CENO-16EGCZ399 on July 22, 2025.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Microchip has released a new Document for the SAM C20/C21 Family Silicon Errata and Data Sheet Clarification of devices. Notification Status: FinalDescription of Change:The following Silicon Issues were added in this revision:? ADC: 1.4.10 Syncbusy Enable? Device: 1.8.15 One-Time Programmable LockThroughout the document, updates were performed to add Silicon Revision H.Impacts to Data Sheet: NoneChange Implementation Status: CompleteEstimated First Ship Date: 07 July 2025
Revision History:November 9, 2020: Issued final notification.December 1, 2020: Re-issued final notification. Corrected the typo error in the date code of the Estimated First Ship Date.December 3, 2020: Re-issued final notification. Removed ATSAMC21J17A-AZ510, ATSAMC21J18A-AZ510, ATSAMC21J17A-AZT510 &ATSAMC21J18A-AZT510 CPNs as they are no longer affected by the change proposed in this PCN.Description of Change:Qualification of UMC Fab 8N as an additional fabrication site for various Atmel catalog part numbers.Reason for Change:Due to unforeseen business conditions, UMC Fab 8N has been qualified as an additional fabrication site effective immediately.January 11, 2024: Re-issued final notification to attached Qualification Report. Update affected CPN list, added new CPNs recently released.
Microchip has released a new Errata for the SAM C20/C21 Family Silicon Errata and Data Sheet Clarification of devices. Description of Change: The following Silicon Issues were updated: ? CCL: 1.7.2 Sequential Logic The following Silicon Issues were added in this revision: ? DEVICE: 1.8.14 Performance Mode The following Data Sheet Clarifications were added in this revision: ? Absolute Maximum Ratings ? EEPROM Emulation Endurance ? 2.3. 48 MHz RC Oscillator (OSC48M) Power Consumption
Part Status:
Microchip ATSAMC20E18A-ANT - Technical Attributes
| Family Name: | SAMC20 |
| Core Processor: | ARM Cortex M0+ |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 256kB |
| RAM Size: | 32kB |
| Speed: | 48MHz |
| No of I/O Lines: | 26 |
| InterfaceType / Connectivity: | I2C/LIN/SPI/UART/USART |
| Peripherals: | Brown-out Detect/DMA/POR/Reset/Watchdog |
| Number Of Timers: | 5 |
| Supply Voltage: | 2.7V to 5.5V |
| Operating Temperature: | -40°C to +105°C |
| On-Chip ADC: | 10-chx12-bit |
| Watchdog Timers: | 1 |
| Package Style: | TQFP-32 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
2000 per Reel
Package Style:
TQFP-32
Mounting Method:
Surface Mount