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Manufacturer Part #
ATSAML22N18A-AUT
SAML22N Series 256 kB Flash 32 kB RAM 32 MHz 32-Bit Microcontroller - TQFP-100
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1000 per Reel Package Style:HTQFP-100 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip ATSAML22N18A-AUT - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).Revision History:August 9, 2024: Issued initial notification.November 20, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 23, 2024.January 8, 2025: Re-issued to correct the pre and post table note from "66L" to "64L". Removed EOL CPNs PIC32MZ1024ECM100T-I/PF and PIC32MZ1024ECM100-I/PF from affected CPN list.
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
***FPCN104919 Update ***Revision History:April 16, 2024: Issued final notification.May 08, 2024: Re-issued final notification. Updated pre and post change summary table to include package type and package width.Description of Change:Implement new carrier tape leader and trailer length for various packages shipped from MPHL site.Reason for Change:To improve manufacturability by standardizing the carrier tape and trailer length for various packages shipped from MPHL site.
Microchip has released a new Errata for the SAM L22 Family Silicon Errata and Data Sheet Clarificaiton of devices.Notification Status: FinalDescription of Change: Rev. E Document (09/2022) The following Errata were added in this revision: ? PORT: 1.6.2 PA24 and PA25 Pull-down Functionality ? ADC: 1.11.7 SEQSTATE ? BOD33: 1.19.1 HysteresisImpacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 06 Sep 2022
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of MPHL as an additional final test site for selected ATSAML22J1xx and ATSAML22N1xx device families available in 64L (10X10X1mm) and 100L (14X14X1mm) TQFP packages.Impacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying MPHL as an additional final test site.Change Implementation Status:In ProgressEstimated First Ship Date:April 18, 2022 (date code: 2217)
Part Status:
Microchip ATSAML22N18A-AUT - Technical Attributes
| Family Name: | SAML22N |
| Core Processor: | ARM Cortex M0+ |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 256kB |
| RAM Size: | 32kB |
| Speed: | 32MHz |
| No of I/O Lines: | 82 |
| InterfaceType / Connectivity: | I2C/SPI/UART/USART/USB |
| Peripherals: | Brown-out Detect/DMA/LCD/POR/PWM/Reset/Watchdog |
| Number Of Timers: | 4 |
| Supply Voltage: | 1.62V to 3.63V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 20-chx12-bit |
| Watchdog Timers: | 1 |
| Package Style: | HTQFP-100 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
1000 per Reel
Package Style:
HTQFP-100
Mounting Method:
Surface Mount