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Manufacturer Part #
PIC32CM1216MC00048-I/U5B
PIC32CM Series 128 kB Flash 16 kB RAM SMT 32-Bit Microcontroller - VQFN-48
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:416 per Tray Package Style:VQFN-48 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip PIC32CM1216MC00048-I/U5B - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
****FPCN115312/FPCN114582 UPDATE/MATERIAL CHANGE*****Description of Change: Qualification of palladium-coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATSAMD21xx, ATSAMC21xx, ATSAMC20xx, ATSAMDA1xx, ATSAMD20xx, ATSAML22xx, ATSAML21xx, PIC32CM2xx, PIC32CM1xx, PIC32CM3xx, PIC32CM6xx, ATSAML10xx,ATSAML11xx and PIC32CM5xx device families available in 32L and 48L VQFN (5x5x1mm and 7x7x0.9mm) packages at MMT assembly site.Reason for Change: To improve manufacturability by qualifying palladium-coated copper with gold flash (CuPdAu) bond wire as an additional wire material.Estimated First Ship Date: 14 November 2025 (date code: 2546)
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
PCN Status:Final NotificationDescription of Change:Qualification of UMC Fab 8N as an additional fabrication site for selected PIC32CM1216MC00032, PIC32CM6408MC00032, PIC32CM1216MC00048, and PIC32CM6408MC00048 device families available in 32L VQFN (5x5x1.0mm), 32L TQFP (7x7x1.0mm), 48L VQFN (7x7x0.9mm) and 48L TQFP (7x7x1.0mm) packages.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UMC Fab 8N as an additional fabrication site.Change Implementation Status:In ProgressEstimated First Ship Date:September 15, 2021 (date code: 2138)
Revision History:September 08, 2021: Issued final notification.April 16, 2024: Re-issued final notification to include qual report. Updated affected CPN list due to updated CCB scope.Description of Change:Qualification of UMC Fab 8N as an additional fabrication site for selected PIC32CM1216MC00032, PIC32CM6408MC00032, PIC32CM1216MC00048, and PIC32CM6408MC00048 device families available in 32L VQFN (5x5x1.0mm), 32L TQFP (7x7x1.0mm), 48L VQFN (7x7x0.9mm) and 48L TQFP (7x7x1.0mm) packages.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UMCFab 8N as an additional fabrication site.
Revision History:November 9, 2020: Issued final notification.December 1, 2020: Re-issued final notification. Corrected the typo error in the date code of the Estimated First Ship Date.December 3, 2020: Re-issued final notification. Removed ATSAMC21J17A-AZ510, ATSAMC21J18A-AZ510, ATSAMC21J17A-AZT510 &ATSAMC21J18A-AZT510 CPNs as they are no longer affected by the change proposed in this PCN.Description of Change:Qualification of UMC Fab 8N as an additional fabrication site for various Atmel catalog part numbers.Reason for Change:Due to unforeseen business conditions, UMC Fab 8N has been qualified as an additional fabrication site effective immediately.January 11, 2024: Re-issued final notification to attached Qualification Report. Update affected CPN list, added new CPNs recently released.
Microchip has released a new Errata for the PIC32CM MC00 Family Silicon Errata and Data Sheet Clarifications of devicesNotification Status: FinalDescription of Change:This revision contains numerous typographical updates throughout the document along with the updates listed here. Obsolete Data Sheet Clarifications were removed for this revision.? The following Errata were added in this revision:? SERCOM USART: 1.6.1 LIN Host Delays? SERCOM USART: 1.6.2 Two stop bits mode in LIN Host? OSC48M: 1.7.1 Start-UpImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 16 Mar 2023
Part Status:
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Microchip PIC32CM1216MC00048-I/U5B - Technical Attributes
| Family Name: | PIC32CM |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 128kB |
| RAM Size: | 16kB |
| InterfaceType / Connectivity: | Serial |
| Supply Voltage: | 2.7V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| Watchdog Timers: | 1 |
| Package Style: | VQFN-48 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
416 per Tray
Package Style:
VQFN-48
Mounting Method:
Surface Mount