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Référence fabricant
PIC32MZ2048EFM100-I/PF
PIC32MZ Series 2 MB Flash 512 kB RAM 200 MHz 32-Bit Microcontroller - TQFP-100
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :90 par Tray Style d'emballage :TQFP-100 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip PIC32MZ2048EFM100-I/PF - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).Revision History:August 9, 2024: Issued initial notification.November 20, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 23, 2024.January 8, 2025: Re-issued to correct the pre and post table note from "66L" to "64L". Removed EOL CPNs PIC32MZ1024ECM100T-I/PF and PIC32MZ1024ECM100-I/PF from affected CPN list.
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Microchip has released a new Errata for the PIC32MZ Embedded Connectivity with Floating Point Unit (EF) Family Silicon Errata and Data Sheet Clarification of devices.Description of Change:Added Silicon revision B3. Updated the Silicon revision to B3 throughout the document. Reason for Change: To Improve Productivity
Microchip has released a new Product Documents for the PIC32MZ Embedded Connectivity with Floating Point Unit (EF) Family Silicon Errata of devices. If you are using one of these devices please read the document located at PIC32MZ Embedded Connectivity with Floating Point Unit (EF) Family Silicon Errata .Notification Status: FinalDescription of Change: The following Data Sheet clarifications were added:4. Module:IVREF DC CharacteristicsImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 17 Mar 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Statut du produit:
Microchip PIC32MZ2048EFM100-I/PF - Caractéristiques techniques
| Family Name: | PIC32MZ |
| Core Processor: | MIPS32 M-Class |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 2MB |
| RAM Size: | 512kB |
| Speed: | 200MHz |
| No of I/O Lines: | 78 |
| InterfaceType / Connectivity: | CANbus/EBI/EMI/Ethernet/I2C/PMP/SPI/SQI/UAB OTG/UART/USART |
| Peripherals: | Brown-out Detect/DMA/I2S/POR/PWM/Reset/Watchdog |
| Supply Voltage: | 2.1V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 40-chx12-bit |
| Watchdog Timers: | 1 |
| Style d'emballage : | TQFP-100 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
90 par Tray
Style d'emballage :
TQFP-100
Méthode de montage :
Surface Mount