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Manufacturer Part #
PIC32MZ2048EFM100-I/PF
PIC32MZ Series 2 MB Flash 512 kB RAM 200 MHz 32-Bit Microcontroller - TQFP-100
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:90 per Tray Package Style:TQFP-100 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip PIC32MZ2048EFM100-I/PF - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).Revision History:August 9, 2024: Issued initial notification.November 20, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 23, 2024.January 8, 2025: Re-issued to correct the pre and post table note from "66L" to "64L". Removed EOL CPNs PIC32MZ1024ECM100T-I/PF and PIC32MZ1024ECM100-I/PF from affected CPN list.
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Microchip has released a new Errata for the PIC32MZ Embedded Connectivity with Floating Point Unit (EF) Family Silicon Errata and Data Sheet Clarification of devices.Description of Change:Added Silicon revision B3. Updated the Silicon revision to B3 throughout the document. Reason for Change: To Improve Productivity
Microchip has released a new Product Documents for the PIC32MZ Embedded Connectivity with Floating Point Unit (EF) Family Silicon Errata of devices. If you are using one of these devices please read the document located at PIC32MZ Embedded Connectivity with Floating Point Unit (EF) Family Silicon Errata .Notification Status: FinalDescription of Change: The following Data Sheet clarifications were added:4. Module:IVREF DC CharacteristicsImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 17 Mar 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Part Status:
Microchip PIC32MZ2048EFM100-I/PF - Technical Attributes
| Family Name: | PIC32MZ |
| Core Processor: | MIPS32 M-Class |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 2MB |
| RAM Size: | 512kB |
| Speed: | 200MHz |
| No of I/O Lines: | 78 |
| InterfaceType / Connectivity: | CANbus/EBI/EMI/Ethernet/I2C/PMP/SPI/SQI/UAB OTG/UART/USART |
| Peripherals: | Brown-out Detect/DMA/I2S/POR/PWM/Reset/Watchdog |
| Supply Voltage: | 2.1V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 40-chx12-bit |
| Watchdog Timers: | 1 |
| Package Style: | TQFP-100 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
90 per Tray
Package Style:
TQFP-100
Mounting Method:
Surface Mount